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A plastic molded power inductive element and its manufacturing method

A technology of power inductors and manufacturing methods, which is applied in the direction of electrical components, transformer/inductor parts, inductor/transformer/magnet manufacturing, etc., can solve the problems of lack of molding pressure, achieve high DC superposition performance, not easy to damage, leakage The effect of less magnetic flux

Active Publication Date: 2021-10-19
SHENZHEN SUNLORD AUTOMOTIVE ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In the prior art, there is a lack of an integrated molded inductor with low molding pressure and simple process.

Method used

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  • A plastic molded power inductive element and its manufacturing method
  • A plastic molded power inductive element and its manufacturing method
  • A plastic molded power inductive element and its manufacturing method

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Embodiment Construction

[0031] In order to make the technical problems, technical solutions and beneficial effects to be solved in the embodiments of the present invention, the present invention will be described in further detail below with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are intended to explain the present invention and is not intended to limit the invention.

[0032] It should be noted that when the element is referred to as "fixed to" or "set to" another element, it can be directly on the other element or indirectly on the other element. When a component is called "connected to" another element, it can be directly connected to another element or indirectly connected to the other element. Additionally, the connection can be either used in a fixed action or a circuit communication function.

[0033] It is to be understood that the term "length", "width", "upper", "lower", "front", "post", "right", "vertical", "le...

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Abstract

The invention provides a molded power inductance element and a manufacturing method thereof. The molded power inductance element includes: a conductor, a magnetic core and a magnetic plastic sealing layer; the conductor includes an integrally formed insulating-treated base and an insulating-treated side surround The joint part and the electrode part, the base part and the side enclosing part are assembled with the magnetic core through no gap fit, and the magnetic plastic sealing layer covers the conductor and the magnetic core without gap . The method is used to make the aforementioned plastic molded power inductance element. The plastic sealing layer completely covers the prefabricated magnetic core and the part of the conductor except the electrodes, and has an integrated structure with less leakage flux; when the equivalent magnetic permeability is as high as 60 or higher, the equivalent saturation magnetic flux density can reach more than 0.55T, and the space The high profit margin is conducive to the design of miniaturized inductors.

Description

Technical field [0001] The present invention relates to the field of plastic molding techniques, and more particularly to a plastic molded power inductive element and a method of fabricating. Background technique [0002] One integrated inductance in electronic components With its ultra-thin body type, superior high current characteristics, ultra-high stability, in the field of automotive electronics, artificial intelligence, 5G and other fields. During conventional powder integrated inductive production, the coil spot welding technology may occur, and there may be a phenomenon in bread welding and leakage, and in the molding process, the coil and solder joints are pressed, and the solder joint is pressed, and the pressure is up to More than 900MPA, the solder joint, coil film, and magnetic powder insulating layers are easily damaged, easy to open, short circuit. [0003] The high reliability molded forming process in the prior art, during the pressing process, the constitutive p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F17/04H01F27/255H01F27/26H01F27/28H01F27/29H01F27/30H01F27/34H01F41/00H01F41/02
CPCH01F17/04H01F27/255H01F27/263H01F27/2847H01F27/292H01F27/306H01F27/346H01F41/00H01F41/0246H01F2017/048
Inventor 王莹莹余鑫树夏胜程李有云
Owner SHENZHEN SUNLORD AUTOMOTIVE ELECTRONICS CO LTD
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