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Double-sided fleece thermal blanket for electronic packaging thermal interface material

A technology of thermal interface materials and electronic packaging, applied in circuits, electrical components, semiconductor devices, etc., can solve the problems of poor plasticity, easy fracture, unsolved compressibility and resilience, etc.

Active Publication Date: 2020-11-13
上海仅博激光技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although carbon fiber has high strength, it has poor plasticity and low elongation, generally less than 2%, and its transverse mechanical properties are only about one percent of the longitudinal mechanical properties. The thermal fleece made of carbon fiber is relatively brittle and easy to break after bending.
When the thermal interface material is installed in the gap between the various components in the electronic product, the width of the gap may be smaller than the overall thickness of the heat-conducting fabric, and the carbon fiber heat-conducting fleece is easy to break after bending, and cannot It is close to the surface of electronic components. Therefore, the heat-conducting fabric disclosed in 201310659254.X cannot be applied to gaps smaller than its thickness due to its lack of compressibility and resilience. In fact, the purpose of the invention of 201310659254.X It is used as a flexible heat sink, not a thermal interface material connecting the chip and the heat sink, so there is no need to solve the problem of compressibility and resilience

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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  • Double-sided fleece thermal blanket for electronic packaging thermal interface material
  • Double-sided fleece thermal blanket for electronic packaging thermal interface material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0087] A double-sided fleece heat-conducting blanket used as a thermal interface material for electronic packaging. The base fabric and the metal fleece are made of copper fiber. The processing method is the floating long-line cut pile method. The long-line braided fabric, then cut the floating long-line pile loop, and then go through the processes of shearing and brushing to obtain a double-sided fleece thermal blanket for electronic packaging thermal interface materials. The base fabric is woven fabric with a thickness of 0.2mm. The height of single-sided red copper metal fluff is 0.1mm, the diameter is 0.005mm, the plastic yield strength is 90MPa, and the measured thermal conductivity is 101W / (m·K).

Embodiment 2

[0089] A double-sided fleece heat-conducting blanket used as a thermal interface material for electronic packaging. The base fabric and the metal fleece are made of copper fiber. The processing method is the floating long-line cut pile method. The long-line braided fabric, then cut the floating long-line pile loop, and then go through the processes of shearing and brushing to obtain a double-sided fleece thermal blanket for electronic packaging thermal interface materials. The base fabric is woven fabric with a thickness of 0.6mm. The height of the single-sided copper fluff is 0.5mm, the diameter is 0.01mm, the plastic yield strength is 90MPa, and the measured thermal conductivity is 93W / (m·K).

Embodiment 3

[0091] A double-sided fleece heat-conducting blanket used as a thermal interface material for electronic packaging. The base fabric and the metal fleece are made of copper fiber. The processing method is the floating long-line cut pile method. The long-line braided fabric, then cut the floating long-line pile loop, and then go through the processes of shearing and brushing to obtain a double-sided fleece thermal blanket for electronic packaging thermal interface materials. The base fabric is a woven fabric with a thickness of 0.9mm. The height of the single-sided copper fluff is 0.3mm, the diameter is 0.02mm, the plastic yield strength is 90MPa, and the measured thermal conductivity is 85W / (m·K).

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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Abstract

The present application discloses a double-sided fleece thermal conduction blanket for electronic packaging thermal interface materials, wherein the double-sided fleece thermal conduction blanket for electronic packaging thermal interface materials includes a layer of base cloth and raised metal fluff, wherein the base cloth is composed of Composed of metal fibers, wherein the number of metal fibers in the cross-section of the base cloth is more than 5, wherein the thickness of the base cloth is 0.05-1.6mm, wherein the metal fluff is respectively arranged on the upper and lower sides of the base cloth, The cross-sectional coverage of the metal fluff is greater than 20%, wherein the height of the metal fluff relative to the base fabric is 0.1-1.0mm on one side, and the diameter of the metal fluff is 0.005-0.1mm. The double-sided fabric of the present invention The fleece thermal blanket has the characteristics of directional heat transfer along the metal fluff, energy absorption and shock absorption.

Description

technical field [0001] The invention relates to a thermal interface material for electronic packaging, in particular to a double-sided fleece heat conduction blanket used for the thermal interface material of electronic packaging. Background technique [0002] Therm Interface Materials (TIM) refers to the interface connection material filled between the chip and the heat dissipation substrate, or between the heat dissipation substrate and the heat sink. The main function is to reduce the interface thermal resistance and improve the heat transfer efficiency. The chip, the heat dissipation substrate, and the heat sink are all rigid bodies. If the chip and the heat dissipation substrate, or the heat dissipation substrate and the heat sink are in direct contact, due to the surface flatness and roughness of the rigid body components, the contact part is only a small amount. There are gaps between most of the surfaces, and these gaps are filled with air, and the thermal conductivi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/367H01L23/373H01L23/00F16F15/04
CPCF16F15/04H01L23/367H01L23/3672H01L23/3735H01L23/3736H01L23/562
Inventor 李雷
Owner 上海仅博激光技术有限公司
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