BOX-shaped silicon nitride waveguide and preparation method thereof
A technology of forming silicon nitride and silicon nitride, which is applied in the field of BOX-shaped silicon nitride waveguide and its preparation, can solve the problems of insufficiently steep sidewalls, low verticality, and time-consuming, so as to reduce the sidewalls. Scatter loss, reduce process links, improve the effect of smoothness
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Embodiment 1
[0053] Such as figure 1 As shown, a BOX-shaped silicon nitride waveguide includes:
[0054] The first cladding layer 2 on the semiconductor substrate 1;
[0055] And the BOX silicon nitride waveguide 3 located on the first cladding layer 2; and the second cladding layer 4 located inside the BOX silicon nitride waveguide 3;
[0056] And a third cladding layer 5 located on the first cladding layer 2 and cladding the BOX silicon nitride waveguide 3;
[0057] The first coating layer 2, the second coating layer 4, and the third coating layer 5 include silicon dioxide;
[0058] The semiconductor substrate 1 is a silicon substrate;
[0059] The thickness of the first coating layer 2 is 3 μm; the thickness of the third coating layer 5 is 7 μm.
[0060] The manufacturing method of the BOX-shaped silicon nitride waveguide of this embodiment includes the following steps:
[0061] S1. Such as Figure 2-4 As shown, using thermal oxygen to grow 3μm thick SiO on a silicon substrate 2 Thick film, then in ...
Embodiment 2
[0078] Such as figure 1 As shown, a BOX-shaped silicon nitride waveguide includes:
[0079] The first cladding layer 2 on the semiconductor substrate 1;
[0080] And the BOX silicon nitride waveguide 3 located on the first cladding layer 2; and the second cladding layer 4 located inside the BOX silicon nitride waveguide 3;
[0081] And a third cladding layer 5 located on the first cladding layer 2 and cladding the BOX silicon nitride waveguide 3;
[0082] The first coating layer 2, the second coating layer 4, and the third coating layer 5 include silicon dioxide;
[0083] The semiconductor substrate 1 is a silicon substrate;
[0084] The thickness of the first coating layer 2 is 2 μm; the thickness of the third coating layer 5 is 5 μm.
[0085] The manufacturing method of the BOX-shaped silicon nitride waveguide of this embodiment includes the following steps:
[0086] S1. Such as Figure 2-4 As shown, using thermal oxygen to grow 2μm thick SiO on a silicon substrate 2 Thick film, then in ...
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