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A kind of manufacturing method of transparent circuit board and transparent LED display screen

A technology for transparent circuit boards and manufacturing methods, which is applied in the fields of printed circuit manufacturing, printed circuit, and reinforcement of conductive patterns, which can solve the problems of falling off, poor adhesion between circuit patterns and transparent substrates, etc. Strong, high-transparency effects

Active Publication Date: 2021-07-23
SHENZHEN NEXNOVO TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The invention provides a method for making a transparent circuit board and a transparent LED display screen, in order to overcome the poor adhesion between the circuit pattern formed by the copper foil and the transparent substrate existing in the prior art when preparing the transparent LED circuit board, and to easily change from the transparent The problem of peeling off on the substrate

Method used

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  • A kind of manufacturing method of transparent circuit board and transparent LED display screen
  • A kind of manufacturing method of transparent circuit board and transparent LED display screen
  • A kind of manufacturing method of transparent circuit board and transparent LED display screen

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0058] This example will specifically explain the manufacturing method of the transparent circuit board provided by the present invention, such as figure 1 shown, including the following steps:

[0059] Step S1, step of forming adhesive lines: making adhesive lines 20 on the transparent substrate 1;

[0060] Step S2, copper powder pressing and bonding step: evenly sprinkle copper powder 3 on the transparent substrate 1 including the adhesive circuit 20, and then press and infiltrate the copper powder 3 into the adhesive circuit 20; Powder 3 has a particle diameter of 500-1000 nm.

[0061] Step S3, forming a copper-clad circuit: removing excess copper powder 3 on the transparent substrate 1 to form a copper-clad circuit 30;

[0062] Step S4 , line gap filling step: filling the gaps between the copper powder particles in the copper-clad circuit 30 to form the circuit pattern 40 .

[0063] Each step is explained in detail below.

[0064] In step S1, the transparent substrate ...

Embodiment 2

[0102] This example will specifically explain the manufacturing method of the transparent LED display provided by the present invention, including the following steps: making a transparent circuit board 300; installing LED lights on the transparent circuit board 300, and then packaging;

[0103] Wherein, the method for manufacturing the transparent circuit board 300 is the method for manufacturing the transparent circuit board provided in the first embodiment above.

[0104] The above-mentioned installation of LED lights adopts the method of surface mount (English full name: Surface Mounted Technology; English abbreviation: SMT), and the reflow soldering temperature in the SMT process is limited to about 260 degrees, and the LED lights are installed on the lamp bead welding area. Then, glue potting can be used to form a waterproof protective layer on the transparent circuit board 300 after installing the LEDs, and then a protective cover is used for protection on the top.

[0...

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Abstract

In order to overcome the problem that the existing transparent circuit board manufacturing method in the prior art is relatively complicated and has poor reliability, the circuit pattern formed by the copper foil has poor adhesion to the transparent substrate, and is easy to fall off from the transparent substrate. The invention provides a method for manufacturing a transparent circuit board and a transparent LED display screen. One aspect of the present invention provides a method for manufacturing a transparent circuit board, comprising the following steps: making an adhesive circuit on a transparent substrate; evenly sprinkling copper powder on the transparent substrate including the adhesive circuit, and then pressing the copper powder together Penetrating into the adhesive circuit; removing excess copper powder on the transparent substrate to form a copper clad circuit; filling gaps between copper powder particles in the copper clad circuit to form a circuit pattern. The manufacturing method of the transparent circuit board provided by the invention can meet the usage requirements of the transparent LED display screen. In the circuit pattern formed by the method, the copper and the transparent substrate are bonded firmly without deformation or falling off.

Description

technical field [0001] The invention relates to the technical field that a printed circuit board of a transparent substrate is used as an LED transparent display screen. Background technique [0002] Printed circuits on transparent substrates are generally used in the field of LCD displays. This circuit forms a metal conductive layer on transparent substrates such as glass by magnetron sputtering, usually copper plating, and then etched on the transparent substrate. Upward to form a circuit pattern, the thickness of this conductive layer is generally at the nanometer level, and the conductive current is very small. In addition, there are plans to use conductive materials such as ITO, nano-silver, and metal grids to form transparent circuit patterns on glass substrates. However, these circuit patterns have large square resistance and small conductive current, so it is difficult to use them when the current demand is large. used on products. [0003] For example, take the tr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/10H05K3/12H05K3/20H05K3/24H05K3/34
CPCH05K3/102H05K3/1216H05K3/207H05K3/245H05K3/3436
Inventor 李淑玲
Owner SHENZHEN NEXNOVO TECH CO LTD