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Low-temperature-sinterable copper particle and method for manufacturing sintered compact using same

A technology of low-temperature sintering and manufacturing methods, which can be used in applications, household appliances, transportation and packaging, etc., and can solve problems such as deterioration of sintering characteristics

Active Publication Date: 2020-08-11
HOKKAIDO UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

According to reports, FT-IR was used to analyze the oxidation state of the copper particle surface, and it was found that the sintering characteristics of the copper particles oxidized after the preheating process in air deteriorated

Method used

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  • Low-temperature-sinterable copper particle and method for manufacturing sintered compact using same
  • Low-temperature-sinterable copper particle and method for manufacturing sintered compact using same
  • Low-temperature-sinterable copper particle and method for manufacturing sintered compact using same

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Embodiment

[0087] Hereinafter, the present invention will be described in more detail through examples, but the present invention is not limited to these examples.

[0088] 1. Formation of carboxylic acid-coated copper particles

[0089] Using a 1 L flask, it was generated based on the following method. 0.1 mol of copper oxide (CuO, manufactured by Nisshin Chemco) as a raw material was put into 100 mL of solvent alcohol (2-propanol or ethanol), and hexanoic acid was added in the range of 2 to 6 mmol while being fully stirred by a stirring blade, After raising the temperature to 70° C. with a water bath, 0.2 mol of hydrazine monohydrate was added to react for 1 to 2 hours. After the reaction, after cooling to room temperature, the supernatant was removed by centrifugation, and the copper particles were purified by performing the same operation using solvents such as ethanol, acetone, and methanol. Finally, fully dry and recover the powder by blowing nitrogen.

[0090] The obtained powd...

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Abstract

Provided are a novel low-temperature-sinterable copper particle that can be sintered even at a low temperature of about 100 DEG C or less, for example, and a method for manufacturing a sintered compact using the same. This low-temperature-sinterable copper particle is coated by a carboxylic acid, and the surface thereof is oxidized so that the cuprous oxide fraction (Cu2O / (Cu+Cu2O) in the copper particle is 4% by mass or less, or the average coating thickness of cuprous oxide is 10 nm or less. The low-temperature-sinterable copper particles are low-temperature sintered in an atmosphere havinga pressure of 0.01 Pa or less.

Description

technical field [0001] The present invention relates to a low-temperature sinterable copper particle and a method for producing a sintered body using the low-temperature sinterable copper particle. Background technique [0002] In recent years, a technology called Print Full Electronic Technology (Print Full Electronic Technology), which uses conductive inks containing metal particles to directly form micron-scale fine wiring by inkjet or printing methods, has become an A cleaning technique that exposes or etches without expelling harmful chemicals is receiving attention. [0003] A film of conductive ink formed by printing or the like is an aggregate of independent metal particles without any treatment, so its conductivity is extremely low. Therefore, a sintered body of metal particles is formed by heat treatment to impart conductivity. Conventionally, it has been required to sinter at a low temperature lower than, for example, 250 to 350°C from the viewpoint of heat resi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/00B22F1/02
CPCB22F9/24H05K1/097C22C1/0425B22F2999/00B22F2998/10B22F1/065B22F1/102B22F1/145B22F1/16B22F1/054B22F3/10B22F2201/50B22F2201/03B22F2301/10B22F2304/058C09D11/037C09D11/322C09D11/52
Inventor 米泽彻塚本宏树
Owner HOKKAIDO UNIVERSITY