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Piezoresistive flexible three-dimensional force sensor array and preparation method thereof

A sensor array and three-dimensional force technology, applied in the measurement of the property force of piezoelectric resistance materials, etc., can solve the problems of cutting and bonding positioning difficulties, crosstalk of pressure sensitive units, and influence of sensitive units, so as to reduce the number and Small interference, enhance the effect of flexibility

Pending Publication Date: 2020-08-14
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Generally speaking, a three-dimensional force sensing unit includes several sensitive units, so the size of each sensitive unit is only a few hundred microns, and it is very difficult to perform accurate cutting and bonding positioning. Therefore, most studies do not cut, and directly use the whole block When the pressure-sensitive unit of the pressure-sensitive layer is subjected to the normal force, it will affect the adjacent sensitive unit, so that the crosstalk between the pressure-sensitive units occurs
On the other hand, the sandwich structure with two layers of metal electrodes on the upper and lower surfaces of the pressure sensitive layer is the most common, but this double layer of metal electrodes limits the flexibility.

Method used

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  • Piezoresistive flexible three-dimensional force sensor array and preparation method thereof
  • Piezoresistive flexible three-dimensional force sensor array and preparation method thereof
  • Piezoresistive flexible three-dimensional force sensor array and preparation method thereof

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preparation example Construction

[0062] refer to Image 6 , the preparation method of piezoresistive flexible three-dimensional force sensor array of the present invention is characterized in that, comprises the following steps:

[0063] S1, spin-coating a high molecular polymer on the substrate silicon, and forming a flexible substrate with a flexible electrode layer after the high molecular polymer is cured;

[0064] S2, spin-coat photoresist on the flexible substrate, form a photoresist mask after exposure and development, then deposit a metal film, and obtain a patterned flexible electrode by a lift-off process;

[0065] S3, preparing a pressure sensitive unit 4 on the surface of the flexible electrode layer;

[0066] S4, spin-coating the flexible insulating filler again, curing the insulating flexible filler to form the pressure-sensitive layer 2, and then peeling off the prepared structure from the substrate silicon;

[0067] S5 , preparing the force decomposition and encapsulation layer 1 , bonding t...

Embodiment

[0072] The piezoresistive flexible three-dimensional force sensor array provided by the present invention is as figure 1 , Figure 2(b), Figure 3 ~ Figure 5 As shown, the overall structure is a three-layer structure, and the three-layer structure is made of flexible materials. like Figure 1 to Figure 5 As shown, the sensor includes a flexible electrode layer 3, a pressure sensitive layer 2, and a force decomposition and encapsulation layer 1. The three-layer flexible structure is closely combined to form the overall structure of the sensor. The flexible electrode layer 3 forms a patterned single-layer positive and negative double-electrode structure on the polyimide film through evaporation and stripping processes, reducing the number of electrode layers and improving the flexibility of the sensor; the pressure-sensitive layer 2 is prepared by photolithography patterning , the conductive polymer composite material is separately arranged on each pair of electrodes to form fo...

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Abstract

The invention discloses a piezoresistive flexible three-dimensional force sensor array and a preparation method thereof. A pressure sensitive layer is arranged on the upper surface of a flexible electrode layer, and a force decomposition and packaging layer is arranged on the upper surface of the pressure sensitive layer; the upper surface of the force decomposition and packaging layer is providedwith protruding structures which are distributed in an array. The pressure sensitive layer comprises a pressure sensitive unit and a flexible insulating filler; the pressure sensitive layer is provided with N (N being greater than or equal to 3) pressure sensitive units at corresponding positions below a stress sensitive part of each convex structure after being stressed; the pressure sensitive units are arranged on the upper surface of the flexible electrode layer; and the space between the force decomposition and packaging layer and the flexible electrode layer is filled with the flexible insulating filler; the flexible electrode layer comprises a flexible substrate and electrodes arranged on the flexible substrate, a pair of electrodes is arranged between each pressure sensitive unit and the flexible substrate, and the electrodes are connected with electrode leading-out wires. According to the invention, the flexibility of the sensor can be further improved, and the crosstalk amongthe pressure sensitive units can be reduced.

Description

technical field [0001] The invention belongs to the technical field of flexible pressure sensors, in particular to a piezoresistive flexible three-dimensional force sensor array and a preparation method thereof. Background technique [0002] Robot dexterous hands and prosthetic hands are important auxiliary tools in human life. With the development of intelligence and the improvement of human living standards, people have put forward some new requirements for robot dexterous hands and prosthetic hands. One of the most important ones is Precise perception of three-dimensional forces experienced by robotic dexterous and prosthetic hands. It is of great significance for improving production efficiency in industry, improving service quality in service industry, and improving the quality of life of disabled people in life. [0003] Traditional silicon-based and other rigid three-dimensional force sensors are limited by the shape of the surface of the mounting carrier, and cannot...

Claims

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Application Information

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IPC IPC(8): G01L1/18
CPCG01L1/18
Inventor 王松王琛英蒋庄德牛忠楠张雅馨林启敬田边张亮亮
Owner XI AN JIAOTONG UNIV
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