A low-temperature and high-temperature online test device for semiconductor devices

An on-line testing and semiconductor technology, which is used in the testing of single semiconductor devices, measuring devices, measuring device casings, etc., can solve the problems of low test accuracy and low test efficiency, and achieve a solution with reduced cleaning difficulty, low work intensity and strong practicability. Effect

Active Publication Date: 2021-02-26
成都思科瑞微电子股份有限公司
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the prior art, when semiconductors are tested at low temperature and high temperature, they are easily affected by the external environment, resulting in low test accuracy and low test efficiency.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A low-temperature and high-temperature online test device for semiconductor devices
  • A low-temperature and high-temperature online test device for semiconductor devices
  • A low-temperature and high-temperature online test device for semiconductor devices

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the examples set forth herein; Fully conveyed to those skilled in the art. The drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus repeated descriptions thereof will be omitted.

[0029] Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more example embodiments. In the following description, numerous specific details are provided in order to give a thorough understanding of example embodiments of the present disclosure. However, those skilled in the art will appreciate that the technical solutions of the present disclosure may be practiced without one or more of ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a low-temperature and high-temperature online testing device for semiconductor devices, and specifically relates to the technical field of semiconductor device testing. It includes a first frame and a second frame, and the second frame is arranged on one side of the first frame. A computer is arranged on the top of the second frame, and a testing mechanism is arranged on the top of the first frame; the testing mechanism includes a cylinder. In the present invention, one of the first refrigerator and the second refrigerator is directly connected to the power supply, and the other is reversely connected to the power supply, thereby forming a high-temperature test chamber and a low-temperature test chamber, and then the motor is started to drive the first ring plate and the second ring plate. The ring plate rotates to realize the switching of the test station, which is convenient and quick. At the same time, the semiconductor device coming out of the high-temperature test chamber is cooled by using a multi-layered wind curtain wall formed at the passing groove and the wind blown out of the ventilation groove. Prevent it from being affected by the external environment and cause low test accuracy.

Description

technical field [0001] The invention relates to the technical field of semiconductor device testing, and more specifically, the invention relates to a low-temperature and high-temperature online testing device for semiconductor devices. Background technique [0002] A semiconductor device is an electronic device whose conductivity is between a good conductor and an insulator. It uses the special electrical properties of semiconductor materials to complete specific functions. It can be used to generate, control, receive, transform, amplify signals and perform energy conversion. The semiconductor materials used are silicon, germanium or gallium arsenide, which can be used as rectifiers, oscillators, light emitters, amplifiers, photometers and other equipment. To distinguish them from integrated circuits, they are sometimes called discrete devices. [0003] However, in the research and development process of each semiconductor device, in order to ensure that the semiconductor ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/26G01R1/02G01R1/04
CPCG01R1/02G01R1/04G01R31/2601
Inventor 马卫东杜秋平李亚飞张鸿李盼
Owner 成都思科瑞微电子股份有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap