Chip attaching assembly, electronic product and manufacturing method of electronic product

Abstract

The invention relates to a chip attaching assembly, an electronic product and a manufacturing method of the electronic product. The chip attaching assembly is used for being attached to the surface ofa curved-surface product through a thermoplastic forming process, and comprises a substrate, an LED chip and two welding pads arranged in a spaced mode, wherein the substrate is provided with a firstlong edge and a first short edge, the length of the first long edge is larger than that of the first short edge, a conductive circuit is arranged on the substrate, the LED chip is provided with a second long edge and a second short edge, the length of the second long edge is larger than that of the second short edge, the length of the first short edge is larger than that of the second long edge,the second long edge of the LED chip is parallel to the first long edge of the substrate, the LED chip is provided with two pins which are arranged at an interval, and the welding pads are arranged between the pins and the conductive circuit and are used for electrically connecting the LED chip with the conductive circuit on the substrate. According to the chip attaching assembly, the electronic product and the manufacturing method of the electronic product, the risk of failure of the LED chip due to stress concentration can be reduced to a great extent.

Description

technical field [0001] The invention relates to the technical field of chip bonding, in particular to a chip bonding component, an electronic product and a manufacturing method of the electronic product. Background technique [0002] In recent years, due to the advantages of Micro-LEDs such as self-illumination, small size, high resolution, strong portability, low power consumption, high brightness, and fast response time, Micro-LEDs have a wide range of applications. In recent years, Micro-LED displays are mainly used in small-pitch, large-size indoor / outdoor displays; wearable devices, such as Apple Watches, AR devices; and foldable displays. In recent years, the curved screen design of the above products has become more and more popular. However, when the Micro-LED chip is attached to the surface of a curved product, the Micro-LED chip is prone to stress concentration, which leads to the risk of failure of the Micro-LED chip. Contents of the invention [0003] Based o...

AI Technical Summary

Problems solved by technology

However, when the Micro-LED chip is attached to the surface of a curved product, the Micro-LED chip is prone to stress concentration, which leads to the risk of Micro-LED chip failure.

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