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A kind of preparation method of high heat resistance, high reliability cem-1 copper clad laminate

A CEM-1, reliable technology, used in chemical instruments and methods, printed circuit manufacturing, paper/cardboard layered products, etc., can solve the problems of non-punching, poor machinability, high manufacturing cost, and reduce the explosion of boards. rate, good adhesion performance, good adhesion effect

Active Publication Date: 2022-06-21
SHANDONG JINBAO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] FR-4 copper clad laminate has high heat resistance, but its manufacturing cost is high, its machinability is poor, and it cannot be punched, and the high heat resistant CEM-1 copper clad laminate can overcome these shortcomings

Method used

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  • A kind of preparation method of high heat resistance, high reliability cem-1 copper clad laminate

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Experimental program
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Effect test

Embodiment 1

[0026] A method for preparing a CEM-1 copper clad laminate with high heat resistance and high reliability, the steps are as follows:

[0027] (1) Preparation of surface material resin: by weight, 59 parts of solvent-based epoxy resin (the epoxy equivalent of low-bromine epoxy resin is 410g / eq, bromine content is 20wt%), 1 part of curing agent Dicyandiamide, 0.1 part of silane coupling agent KH-550, 0.1 part of curing accelerator 2-methylimidazole, 19 parts of solvent DMF and 21 parts of flame retardant aluminum hydroxide are mixed and stirred evenly;

[0028] (2) Prepare lining-impregnation resin: by weight, 40 parts of water-soluble phenolic resin, 200 parts of methanol, 30 parts of acetone and 100 parts of water are mixed and stirred evenly;

[0029] (3) Preparation of lining secondary dipping resin: by weight, 43 parts of polyvinyl formal-polyvinyl alcohol-polyacrylic acid copolymer, 40 parts of E-51 epoxy resin, 125 parts of solvent-type phenolic resin, 20 parts of cyanat...

Embodiment 2

[0042] A method for preparing a CEM-1 copper clad laminate with high heat resistance and high reliability, the steps are as follows:

[0043] (1) Preparation of table material resin: 40 parts of solvent-based epoxy resin (the epoxy equivalent of low-bromine epoxy resin is 420g / eq, bromine content is 20wt%), 1 part of curing agent dicyandiamide, 0.1 part Curing accelerator 2-methylimidazole, 25 parts of solvent acetone and 25 parts of flame retardant aluminum hydroxide are mixed and stirred evenly;

[0044] (2) Preparation of lining-impregnation resin: by weight parts, 30 parts of water-soluble phenolic resin, 180 parts of methanol, 40 parts of acetone and 120 parts of water are mixed and stirred evenly;

[0045](3) Preparation of lining two-impregnation resin: in parts by weight, 40 parts of polyvinyl formal-polyvinyl alcohol-polyacrylic acid copolymer, 20 parts of tetrabromobisphenol A type epoxy resin (epoxy equivalent is 410g / eq), 128 parts of solvent-based phenolic resin,...

Embodiment 3

[0050] A method for preparing a CEM-1 copper clad laminate with high heat resistance and high reliability, the steps are as follows:

[0051] (1) Preparation of table material resin: 55 parts of solvent-based epoxy resin (the epoxy equivalent of low-bromine epoxy resin is 410g / eq, bromine content is 20wt%), 1 part of curing agent dicyandiamide, 0.1 part Curing accelerator 2-methylimidazole, 35 parts of solvent butanone, 5 parts of flame retardant aluminum hydroxide, 10 parts of flame retardant magnesium hydroxide and 5 parts of flame retardant antimony trioxide are mixed and stirred evenly;

[0052] (2) Prepare lining-impregnation resin: by weight, 35 parts of water-soluble phenolic resin, 200 parts of methanol, 35 parts of acetone and 120 parts of water are mixed and stirred evenly;

[0053] (3) Preparation of lining secondary dipping resin: by weight, 45 parts of polyvinyl formal-polyvinyl alcohol-polyacrylic acid copolymer, 30 parts of phosphorus-containing epoxy resin (epo...

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Abstract

The invention belongs to the technical field of copper-clad laminate production, and relates to a preparation method of a CEM‑1 copper-clad laminate with high heat resistance and high reliability. In the present invention, the wood pulp fiber paper is respectively impregnated with the first impregnation resin of the lining material and the second impregnation resin of the lining material, especially in the second impregnation resin of the lining material, the polyvinyl formal-polyvinyl alcohol-polyacrylic acid copolymer greatly improves the interlayer adhesion Cyanate ester resin and its modified resin have excellent high-temperature mechanical properties, bending strength and tensile strength, and they have extremely low water absorption, low molding shrinkage and good dimensional stability. It has good hygrothermal properties, flame retardancy and cohesiveness, and has good bonding performance with glass fiber, carbon fiber, quartz fiber, whisker and other reinforcing materials and electronic grade fillers. The heat resistance of the copper-clad laminate prepared by the invention can reach 288°C, and the floating soldering for more than 60 seconds will not delaminate or bubble, and the heat resistance will be significantly improved; thereby significantly reducing the explosion rate during maintenance welding and greatly improving work efficiency.

Description

technical field [0001] The invention relates to a copper-clad laminate, in particular to a method for preparing a CEM-1 copper-clad laminate with high heat resistance and high reliability, and belongs to the technical field of copper-clad laminate production. Background technique [0002] The EU WEEE (Waste and Waste Electrical and Electronic Equipment) and ROHS (Prohibition of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment) directives, which came into effect on July 1, 2006, stipulate that new electrical and electronic products put on the market must not contain lead, mercury, Six kinds of toxic substances including cadmium indicate that the global electronics industry has entered the era of lead-free soldering. The typical lead-free reflow soldering temperature is 245-265°C for one minute; the repair soldering temperature peak will reach 300°C for a few seconds. If the heat resistance of the copper clad laminate is poor, measures such as lo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B17/04B32B17/06B32B15/20B32B27/04B32B27/38B32B27/42B32B27/30B32B27/36B32B27/18B32B29/00B32B7/08B32B7/027B32B33/00B32B37/10B32B37/06B32B38/08C08J5/24C08L63/00C08K13/04C08K7/14C08K3/22D21H17/48D21H17/36D21H17/52D21H17/54D21H17/37D21H17/68D21H17/67H05K3/00
CPCB32B15/20B32B15/14B32B29/02B32B7/08B32B7/027B32B33/00B32B37/1018B32B37/06B32B38/08C08J5/24D21H17/48D21H17/36D21H17/52D21H17/54D21H17/37D21H17/68D21H17/675H05K3/0011B32B2260/023B32B2260/026B32B2260/046B32B2262/067B32B2262/101B32B2307/306B32B2457/08C08J2363/00C08K7/14C08K2003/2227C08K2003/2224C08K3/2279
Inventor 李凌云杨永亮郑宝林刘政栾好帅王丽亚姜晓亮
Owner SHANDONG JINBAO ELECTRONICS
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