Method for metallically filling glass adapter plate through holes
A glass transfer plate, metallization technology, applied in metal material coating process, liquid chemical plating, coating and other directions, can solve the problem of high technical cost, and achieve the effect of quality assurance and cost reduction
Inactive Publication Date: 2020-08-25
UNIV OF ELECTRONICS SCI & TECH OF CHINA +1
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Problems solved by technology
Faced with the miniaturization of aperture and the increase of aspect ratio (ratio of hole depth to aperture), deep-hole sputtering, physical vapor deposition and atomic layer deposition technologies can all achieve high-quality metal seed layers, but The cost of these technologies is very high, and related equipment needs to be imported
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Embodiment 1
[0036] The method for metallizing and filling the through hole of the glass interposer adopts the following steps:
[0037] A. Put the adapter plate into the degreasing solution at a temperature of 85°C, and apply an ultrasonic field. After the ultrasonic field lasts for 8 minutes, take the adapter plate out of the solution and put it into deionized water, and apply an ultrasonic field. The ultrasonic field lasts for 5 minutes;
[0038] B. Take out the adapter plate and put it into a solution with a concentration of 4ml / L 3-(2-aminoethylamino)propyltrimethoxysilane, let it stand for 35 minutes, take out the sample, put it into the turntable to make the organic matter return to the glass surface Cover evenly, adjust the environment to 100Pa, and let it stand for 10 minutes, control the rotation of the turntable, and shake off the excess silane coupling agent solution;
[0039] C. Take out the adapter plate and heat the adapter plate at 110°C for 30 minutes;
[0040] D. Put th...
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The invention provides a method for metallically filling glass adapter plate through holes. The method comprises the following steps: placing an adapter plate into oil-removal liquor with certain concentration, controlling the temperature to be higher than 80 DEG C, applying ultrasonic wave fields for 5-10 minutes, then, putting the adapter plate into deionized water, and applying ultrasonic wavefields for 5-10 minutes; taking out the adapter plate and putting the adapter plate into a silane coupling agent solution with concentration of 3.5-4.5 ml / L to stand for 30 minutes or more; uniformlycovering the adapter plate through a rotary disc; heating the adapter plate to a temperature of 110 DEG C to keep for 30-50 minutes; putting the adapter plate into a palladium colloid solution to stand for 5 minutes; putting the adapter plate into a silver nitrate solution to stand for 5 minutes; chemically plating under high-rotation-speed environment; and electrically plating under special current and chemical plating liquor. According to the method provided by the invention, self-catalysis catalytic nuclei is adsorbed on the surface of the glass adapter plate after surface treatment and activation treatment is performed on the glass adapter plate, so that basic conditions are provided for chemical plating, and therefore, chemical plating is smoothly accomplished. Compared with the priorart, the method greatly reduces the cost, and guarantees mass of a metal seed layer on the inner walls of the through holes.
Description
technical field [0001] The invention relates to the technical field of preparation of a three-dimensional integrated packaging transfer board, in particular to a method for metallizing and filling through holes of a glass transfer board. Background technique [0002] With the development of microelectronics technology, quantum effects such as tunnel penetration faced by integrated circuits have become increasingly prominent, and Moore's Law has also encountered unprecedented bottlenecks, and these bottlenecks are expected to be broken through advanced three-dimensional integrated packaging technology. Among them, the transfer board plays an important role in the three-dimensional integrated packaging technology: the chips are vertically interconnected through the high-density copper-plated through-hole transfer board, which greatly shortens the length of the interconnection line, which significantly reduces the system cost. parasitic parameters, power consumption, signal del...
Claims
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IPC IPC(8): C23C18/40C23C18/18C25D3/38C25D5/18C25D5/54C25D7/04
CPCC23C18/1893C23C18/405C25D3/38C25D5/18C25D5/54C25D7/04
Inventor 陈雨哲张继华陈宏伟高莉彬方针曲胜邹思月王文君蔡星周穆俊宏
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA