Novel P-type crystalline silicon battery structure and preparation process thereof
A technology of crystalline silicon battery and preparation process, applied in the direction of sustainable manufacturing/processing, circuit, photovoltaic power generation, etc., can solve the problems of high risk, long return on investment period, and incomplete localization of materials and equipment, and achieve quick results , low investment cost, and short upgrade cycle
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[0012] refer to figure 1 , a new P-type crystalline silicon battery structure and its preparation process. The back film layer structure is SixNy / SiOxNy / BSG / P++ from bottom to top, in which BSG / P++ is formed by boron diffusion, and the thickness of P++ layer is 100-200nm, which is close to The doping concentration on the back surface of the silicon substrate is 1x10 19 -5x10 19 / cm -3 Between, BSG film thickness is 3-5nm, doping concentration is 3x10 20 -5x10 20 / cm -3 ; The SixNy / SiOxNy film layer is deposited by PECVD equipment, the refractive index of SiOxNy is 1.7-2.0, the thickness is 3-5nm, the refractive index of SixNy is 2.1-2.3, the thickness is 120-150nm, and the total thickness of the stack is 125-155nm.
[0013] Concrete preparation process implementation process is as follows:
[0014] 1. Clean the velvet. Alkali texturing is used for texturing, the etching amount is controlled at 0.4-0.6g, and the reflectivity is 7%-12%.
[0015] 2. Diffusion knots.
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