Novel P-type crystalline silicon battery structure and preparation process thereof
A technology of crystalline silicon cells and preparation process, applied in sustainable manufacturing/processing, circuits, photovoltaic power generation, etc., can solve the problems of incomplete localization of materials and equipment, high risks, long investment return period, etc., and achieve an upgrade cycle The effect of short, quick effect and low investment cost
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[0012] refer to figure 1 , a new P-type crystalline silicon battery structure and its preparation process. The back film layer structure is SixNy / SiOxNy / BSG / P++ from bottom to top, in which BSG / P++ is formed by boron diffusion, and the thickness of P++ layer is 100-200nm, which is close to The doping concentration on the back surface of the silicon substrate is 1x10 19 -5x10 19 / cm -3 Between, BSG film thickness is 3-5nm, doping concentration is 3x10 20 -5x10 20 / cm -3 ; The SixNy / SiOxNy film layer is deposited by PECVD equipment, the refractive index of SiOxNy is 1.7-2.0, the thickness is 3-5nm, the refractive index of SixNy is 2.1-2.3, the thickness is 120-150nm, and the total thickness of the stack is 125-155nm.
[0013] Concrete preparation process implementation process is as follows:
[0014] 1. Clean the velvet. Alkali texturing is used for texturing, the etching amount is controlled at 0.4-0.6g, and the reflectivity is 7%-12%.
[0015] 2. Diffusion knots.
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