Chip heat dissipation device capable of collecting condensate water
A technology for chip heat dissipation and condensing water, which is applied in electrical components, electric solid devices, circuits, etc., can solve the problems of low air-cooled cooling efficiency and the temperature drops below the ambient temperature, and achieves the effect of reducing the ambient temperature and preventing damage.
Active Publication Date: 2020-09-01
李纲
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Problems solved by technology
[0003] The technical problem to be solved by the present invention is to provide a chip cooling device that can collect condensed water, which overcomes the problems of low heat dissipation efficiency of traditional air-cooled water cooling and difficulty in lowering the temperature below the ambient temperature
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[0018] Combine below Figure 1-5 The present invention is described in detail, wherein, for the convenience of description, the orientations mentioned below are defined as follows: figure 1 The up, down, left, right, front and back directions of the projection relationship itself are the same.
[0019] combined with Figure 1-5The chip cooling device that can collect condensed water includes a chassis 10, the chassis 10 is provided with a closed chassis cavity 11, the chassis cavity 11 is provided with a main board 24, and the main board 24 is fixed on the The inner peripheral wall of the cavity 11 of the chassis, the upper end of the main board 24 is fixed with a chip 25, the cavity 11 of the chassis is provided with a chip cooling device 91, the chip cooling device 91 includes a radiator shell 30, and the radiator The casing 30 is fixedly arranged on the upper inner wall of the chassis cavity 11, the radiator casing 30 is provided with a radiator cavity 31 with upper and l...
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The invention discloses a chip heat dissipation device capable of collecting condensate water, which comprises a case, wherein a closed case cavity is formed in the case, a mainboard is arranged in the case cavity, the mainboard is fixedly arranged on the peripheral wall of the inner side of the case cavity, a chip is fixedly arranged at the upper end of the mainboard, a chip heat dissipation device is arranged in the case cavity, and the chip head dissipation device comprises a radiator shell. According to the invention, fluorine, chlorine and oxygen are compressed through a compression device, the heat is absorbed in the process of converting the liquid state into the gas state, the heat on the chip is taken away, the temperature is reduced to be much lower than the environment temperature, and special requirements are met. In addition, the chip heat dissipation device is provided with a condensate water recycling device, so that electronic components are prevented from being damagedby condensate water, and the recycled condensate water is used for evaporation and heat dissipation, so that the environment temperature of the case is reduced.
Description
technical field [0001] The invention relates to the related field of chip cooling devices, in particular to a chip cooling device capable of collecting condensed water. Background technique [0002] Chips are an important product in the process of human development. At present, human work and entertainment are inseparable from electronic equipment. As the core of computers, chips also generate a lot of heat during work. Traditional chip cooling methods are air-cooled and water-cooled. Cooling is to blow air through the fan to accelerate the heat exchange between the chip and the air. The heat dissipation efficiency is not high, and the water cooling heat dissipation needs to keep the working environment temperature within a certain range. If the temperature is too low, the internal liquid will freeze and become solid, which will cause pipeline Damaged, and it is difficult for water-cooled and air-cooled to lower the temperature below the current ambient temperature, which ca...
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IPC IPC(8): H01L23/367H01L23/427H01L23/467
CPCH01L23/3672H01L23/427H01L23/467
Inventor 丁刚
Owner 李纲