High-precision small-size multi-layer different-structure double-faced adhesive tape assembly and die cutting production process thereof

Abstract

The invention relates to a high-precision small-size multi-layer different-structure double-faced adhesive tape assembly and a production process thereof. The double-faced adhesive tape assembly sequentially comprises a bottom release film, a first double-faced adhesive tape layer, a middle release film, a second double-faced adhesive tape layer and a transparent PET film from bottom to top. A hollowed-out part is formed in the first double-faced adhesive tape layer, and the outer contour line of the second double-faced adhesive tape layer is located in the outer contour line of the middle release film; a handle part which extends outwards and protrudes out of the edge of the middle release film is further arranged on one side of the transparent PET film, a single-sided adhesive tape is compounded at the position, close to the outer end, of the lower surface of the handle part, a through hole is formed in the position, close to the inner end, of the handle part, and a pre-folding lineis arranged at the joint of the handle part and the transparent PET film body. The multi-layer double-faced adhesive tape assembly of different structures can be directly completed on a production line, manual assembly operation is not needed, and thus the production efficiency and the product precision can be greatly improved, and the requirement of the market for the yield and the requirement ofelectronic products for the precision of the double-faced adhesive tape assembly are met.

Description

Technical field: [0001] The invention relates to the technical field of composite die-cutting materials around electronic products, in particular to a high-precision, small-size, multi-layered and different-structure double-sided adhesive component and a die-cutting production process thereof. Background technique: [0002] At present, the design of electronic products such as computers, mobile phones, and tablet computers is becoming more and more sophisticated, and the size requirements are getting higher and higher, so the requirements for various composite die-cut components used in them are also getting higher and higher. [0003] In the current die-cutting industry, components containing multiple layers of double-sided adhesive are often used, and the size and shape of each layer of double-sided adhesive are different. In the prior art, such structural parts generally adopt the assembly process. The product is divided into upper and lower parts, different sizes are sep...

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Problems solved by technology

[0003] In the current die-cutting industry, components containing multiple layers of double-sided adhesive are often used, and the size and shape of each layer of double-sided adhesive are different. In the prior art, such structural parts generally adopt the assembly process. The product is divided into upper and lower parts, different sizes are separated, punched and shaped separately, and then assembled together with manual jigs, but this assembly process has two unavoidable shortcomings: 1. The assembly accuracy is not high , there is at least a tolerance of ±0.2mm. 2. The production efficiency is low, and it is difficult to meet the production capacity requirements of the order. For such small-sized precision structural parts of electronic products, the accuracy requirements are generally ±0.1mm or even higher.

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