Manufacturing method of conductive gasket

Abstract

The invention discloses a manufacturing method of a conductive gasket. The conductive gasket comprises an elastic core, a metal conductive layer and a weldable connecting block, the section of the elastic core is of an unclosed hollow structure, the metal conductive layer wraps the outer surface of the elastic core, and a gap is reserved between the two ends of the metal conductive layer. An adhesion promoting layer is arranged between the metal conductive layer and the elastic core; the weldable connecting block is arranged on the outer surface of the metal conducting layer and connected withthe two ends of the metal conductive layer; the metal conductive layer comprises an electrolytic copper foil and a nanoscale metal layer formed at one side of the electrolytic copper foil in an electroplating mode, the electrolytic copper foil makes contact with the adhesion promoting layer, and the nanoscale metal layer makes contact with the weldable connecting block; the elastic core is made of solid silica gel, silica gel foam, EPDM or PEN; and the weldable connecting block is made of a copper tinned material. Thus, the processing technology can be simplified, and the conductivity and weather resistance of the conductive gasket are improved.

Description

technical field [0001] The invention relates to the technical field of making a conductive pad, in particular to a method for making a conductive pad. Background technique [0002] Various electromagnetic waves generated by the circuits of electronic equipment will cause electromagnetic interference, affect the normal use of electronic equipment, damage electronic imaging, reduce the service life of electronic equipment, etc., and eventually cause electronic equipment to fail and cannot be used. In addition, electromagnetic interference may also cause adverse effects on the human body and the natural environment. In related fields such as electronics, communication, and medical treatment, elastic conductive gaskets are usually used to solve this problem, which can not only fill the gaps inside the electronic equipment, but also ensure that the leakage of electromagnetic waves is prevented, thereby reducing the harm of electromagnetic interference. [0003] With the increasi...

AI Technical Summary

Problems solved by technology

[0005] 1. The surface of polyimide as the base material is coated with multi-layer metal and then laminated with a conductive pad structure of compressible foam. The minimum resistivity can reach 0.1Ω, which cannot meet the increasingly serious electromagnetic interference. If you want to obtain a lower The resistance value needs to be thickened. The thicker the metal coating, the worse the bonding force between the metal layers, and the bonding force with the polyimide substrate is also reduced.

During use, continuous compression and rebound will cause the metal coating to crack or peel off, resulting in poor function

[0006] 2. The conductive foam wrapped by conductive cloth is hard as a whole, cannot be rubbed or stretched, and is easy to wrinkle

It is difficult to control the density of the conductive cloth to be completely uniform, so the resilience of the conductive pad after wrapping is uneven

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