A method of manufacturing a conductive pad

Abstract

The invention discloses a method for making a conductive gasket. The conductive gasket includes an elastic core, a metal conductive layer and a weldable connection block; the section of the elastic core is an unclosed hollow structure, and the metal conductive layer covers the elastic core On the surface, there is a gap between the two ends of the metal conductive layer; there is an adhesion-promoting layer between the metal conductive layer and the elastic core; the weldable connection block is arranged on the outer surface of the metal conductive layer, and the weldable connection block and the two ends of the metal conductive layer Connection; the metal conductive layer includes electrolytic copper foil and a nano-scale metal layer formed by electroplating on one side of the electrolytic copper foil, the electrolytic copper foil is in contact with the adhesion-promoting layer, and the nano-scale metal layer is in contact with the solderable connection block; the elastic core The material is solid silicone, silicone foam, EPDM or PEN; the solderable connection block is made of tinned copper. Through the above method, the present invention can simplify the processing technology and improve the electrical conductivity and weather resistance of the conductive pad.

Description

technical field [0001] The invention relates to the technical field of conductive pad manufacturing, in particular to a manufacturing method of a conductive pad. Background technique [0002] Various electromagnetic waves generated by the circuit of electronic equipment will cause electromagnetic interference, affect the normal use of electronic equipment, damage electronic imaging, reduce the service life of electronic equipment, etc., and eventually lead to failure of electronic equipment to be used. In addition, electromagnetic interference may also cause adverse effects on the human body and the natural environment. In electronics, communications, medical and other related fields, elastic conductive gaskets are usually used to solve this problem, which can not only fill the gaps inside the electronic equipment, but also ensure that the leakage of electromagnetic waves is blocked, thereby reducing the harm of electromagnetic interference. [0003] With the increasingly l...

AI Technical Summary

Problems solved by technology

[0005] 1. The surface of polyimide as the base material is coated with multi-layer metal and then laminated with a conductive pad structure of compressible foam. The minimum resistivity can reach 0.1Ω, which cannot meet the increasingly serious electromagnetic interference. If you want to obtain a lower The resistance value needs to be thickened. The thicker the metal coating, the worse the bonding force between the metal layers, and the bonding force with the polyimide substrate is also reduced.

During use, continuous compression and rebound will cause the metal coating to crack or peel off, resulting in poor function

[0006] 2. The conductive foam wrapped by conductive cloth is hard as a whole, cannot be rubbed or stretched, and is easy to wrinkle

It is difficult to control the density of the conductive cloth to be completely uniform, so the resilience of the conductive pad after wrapping is uneven

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