Water-soluble colloid, conductive film and preparation method thereof
A technology of water-soluble colloid and conductive film, applied to the conductive layer on the insulating carrier, equipment for manufacturing conductive/semiconductive layer, cable/conductor manufacturing, etc., can solve the problem of uniformity, poor consistency, complex production process, Unfriendly to the environment and other issues, to achieve the effect of good consistency, high conductivity, and rich choices
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[0022] A kind of preparation method of conductive thin film, comprises the following steps:
[0023] Step 1: providing a planar grid-like screen, attaching the screen to a base to form a first base. The shape and size of the screen and the base can be adjusted according to the size of the actual product. The aperture of the screen is 10-500 μm, preferably, 20-200 μm; the wire diameter is 500 nm-5 μm.
[0024] The shape of the mesh can be square, rectangular, circular, oval, rhombus, parallelogram or other polygons.
[0025] The substrate can be an inorganic glass substrate, or an organic flexible substrate, such as polyester film (PET), polyimide film (PI) and the like.
[0026] In order to ensure a good printing effect, the screen and the substrate need to be closely adhered without gaps, so as to ensure that a complete conductive film with good consistency can be formed in the subsequent steps.
[0027] Step 2: Coating the above water-soluble colloid on the first substrate...
Embodiment 1
[0038] combined reference figure 1 , Figure 2(a)-2(d) , Figure 3-4 , the preparation method of conductive thin film in the present embodiment comprises the following steps:
[0039] Step 1: Provide a planar mesh screen 102 made of nickel, with a size of 10 cm×10 cm, a square mesh with a diameter of 100 μm, and a wire diameter of 2 μm. The screen 102 is pasted on the surface of the substrate 101 to form the first substrate 11 . In this embodiment, the substrate is a PET film.
[0040]Step 2: Scrape the water-soluble colloid 103 with a concentration of 30% on the first substrate 11 to form the second substrate 12. In the second substrate 12, the thickness of the water-soluble colloid 103 is not higher than the thickness of the screen 102, And the water-soluble colloid 103 penetrates into the mesh of the screen 102 and adheres to the PET substrate 101 .
[0041] Step 3: Baking the second substrate 12 at 100 degrees Celsius for 2-10 minutes to remove moisture and solidify t...
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Abstract
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