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Vacuum coating substrate temperature monitoring assembly based on infrared detection technology

A technology of vacuum coating and infrared detection, applied in vacuum evaporation coating, measuring device, sputtering coating, etc., can solve the problems of inaccurate measurement temperature, lower product quality, inaccurate temperature monitoring, etc.

Pending Publication Date: 2020-09-11
合肥邦诺科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, the temperature patch measurement method is not accurate enough to measure the temperature, and the measurement interval is relatively large, generally at an interval of 20-30 degrees. In this way, the temperature monitoring during the coating process is not accurate enough to affect high-quality, especially functional films. Reduced product quality, and pass rate, increased costs

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  • Vacuum coating substrate temperature monitoring assembly based on infrared detection technology
  • Vacuum coating substrate temperature monitoring assembly based on infrared detection technology
  • Vacuum coating substrate temperature monitoring assembly based on infrared detection technology

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Embodiment Construction

[0034] The specific implementation manners of the present invention will be further described below in conjunction with the drawings and examples. The following examples are only used to illustrate the technical solution of the present invention more clearly, but not to limit the protection scope of the present invention.

[0035] Such as Figure 1 to Figure 7 As shown, the present application discloses a vacuum coating substrate temperature monitoring assembly based on infrared detection technology, including a vacuum chamber 1, a crucible 2 is arranged at the bottom of the vacuum chamber 1, and a rotating umbrella stand 3 is arranged above the crucible 2 A plurality of substrates 4 are evenly distributed on the rotating umbrella stand 3; the vacuum chamber 1 is connected with a mechanical pump and a molecular pump to realize a vacuum environment.

[0036] An electron gun 5 is arranged above the side of the crucible 2, and the heating end of the electron gun 5 faces the dire...

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Abstract

The invention discloses a vacuum coating substrate temperature monitoring assembly based on an infrared detection technology. The vacuum coating substrate temperature monitoring assembly comprises a vacuum cavity, wherein an infrared detector is mounted in the vacuum cavity; a signal transmission window is formed in the cavity wall of the vacuum cavity; an inner wireless communication module is mounted on the inner side of the signal transmission window; an outer wireless communication module matched with the inner wireless communication module for transmission is mounted on the outer side ofthe signal transmission window; the inner wireless communication module is in signal transmission connection with the infrared detector; and the outer wireless communication module is in signal transmission connection with a controller.

Description

technical field [0001] The invention relates to a vacuum coating substrate temperature monitoring component based on infrared detection technology. Background technique [0002] With the development of science and technology, many scientists around the world are actively conducting research on new materials, especially thin film materials. Reasons why thin film materials science is the fastest growing branch of materials science: [0003] (1) With the development of modern science and technology, especially the development of microelectronics technology, functions that used to require a combination of many materials can now be completed with only a few devices or an integrated circuit board. Thin film technology is the most effective technical means to realize the miniaturization of devices and systems; [0004] (2) The miniaturization of the device can not only maintain the original function of the device and make it more strengthened, but also as the size of the device d...

Claims

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Application Information

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IPC IPC(8): C23C14/30C23C14/54G01J5/00
CPCC23C14/30C23C14/54G01J5/0003
Inventor 谢斌刘亮
Owner 合肥邦诺科技有限公司