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Composite radiator and processing method thereof

A processing method and heat sink technology, applied in the direction of cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc., can solve the problems of high heat dissipation efficiency, small size of heat sink, etc., and achieve improved heat dissipation efficiency and best performance , Solve the effect of low cooling efficiency

Pending Publication Date: 2020-09-18
东莞市亿佰金属制品有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a composite heat sink and its processing method, aiming to solve the technical problem that the heat sink in the prior art cannot take into account the small volume and high heat dissipation efficiency

Method used

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  • Composite radiator and processing method thereof
  • Composite radiator and processing method thereof
  • Composite radiator and processing method thereof

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Embodiment Construction

[0036] It should be noted that if there is a directional indication (such as up, down, left, right, front, back...) in the embodiment of the present invention, the directional indication is only used to explain the position in a certain posture (as shown in the accompanying drawing). If the specific posture changes, the directional indication will also change accordingly.

[0037] In addition, if there are descriptions involving "first", "second" and so on in the embodiments of the present invention, the descriptions of "first", "second" and so on are only for descriptive purposes, and should not be interpreted as indicating or implying Its relative importance or implicitly indicates the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In addition, the technical solutions of the various embodiments can be combined with each other, but it must be based on the realizat...

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Abstract

The invention relates to the technical field of radiators, in particular to a composite radiator and a processing method thereof. The composite radiator comprises an upper cover plate and a base; a plurality of first folding fins are arranged between the upper cover plate and the base at intervals; a first mounting groove is formed in the upper surface of the base and located between every two adjacent first folding fins; first flat pipes which are parallel to each other are inserted into each first mounting groove; a first end cover matched with the upper cover plate in an inserted mode is arranged at one end of the first flat pipe in a sealed mode, the other end of the first flat pipe communicates with a lower cavity formed in the bottom of the base, a lower cover plate is arranged at anopening of the lower cavity in a sealed mode, an air injection pipe communicating with the lower cavity is arranged on one side wall of the base, and the lower cavity is filled with a refrigerant. According to the invention, the problem that an existing radiator is low in heat dissipation efficiency is solved, the composite radiator is compact in structure, and the problem of high-power heat dissipation can be better solved within a limited installation space range.

Description

technical field [0001] The invention relates to the technical field of radiators, in particular to a composite radiator and a processing method thereof. Background technique [0002] With the development trend of miniaturization and light weight of electronic equipment and electronic components, the performance requirements and functional density of components are getting higher and higher. Due to the thermoelectric coupling characteristics of components themselves, their own power consumption is also increasing. Among the common faults of electronic equipment, the reason why the equipment cannot work normally due to the high temperature of the electronic equipment accounts for a considerable proportion. Therefore, the temperature inside the electronic equipment must be strictly controlled to ensure the normal and reliable operation of the heating components. The size of electronic products is getting smaller and smaller, and the heat generated per unit space is getting bigg...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20327H05K7/20409
Inventor 郑金航赖阳军
Owner 东莞市亿佰金属制品有限公司