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Semiconductor device

A semiconductor and transistor technology, applied in the field of semiconductor devices, can solve the problems of engine mechanism damage, engine tempering, deflagration, etc., and achieve the effect of slow main current cut-off action and prevention of ignition action

Active Publication Date: 2020-09-18
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Depending on the timing of the breaking operation, there is a risk of engine flashback, knocking, etc., causing damage to the engine mechanism

Method used

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  • Semiconductor device
  • Semiconductor device
  • Semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0026] figure 1 It is a circuit diagram showing the semiconductor device according to Embodiment 1. This semiconductor device is used in an induction ignition type ignition system for an internal combustion engine such as an automobile engine. A power supply Vbat such as a battery is connected to one end of the primary side coil 1a and one end of the secondary side coil 1b of the ignition coil 1 as an L load. The power supply voltage Vbat is 14V. The gate of the insulated gate switching element Q1 is connected to the control circuit 2 , the collector is connected to the other end of the primary side coil 1 a , and the emitter is grounded via a resistor Rs1 . The threshold voltage Vth of the switching element Q1 is 2V. The resistance value of the resistor Rg1 is on the order of tens of kΩ. One end of the spark plug 3 is connected to the other end of the secondary side coil 1b, and the other end is grounded. The control circuit 2 controls the switching element Q1 in accorda...

Embodiment approach 2

[0043] Figure 5 It is a diagram showing operation waveforms of the semiconductor device according to the second embodiment. In this embodiment, the gate capacitance of NM2 is set to be smaller than the gate capacitance of switching element Q1. As a result, when an operation abnormality is detected, NM2 is turned on before switching element Q1 is turned off, and thus a stable off operation of the second clamp circuit 10 can be realized. Other configurations and effects are the same as those in Embodiment 1.

Embodiment approach 3

[0045] Figure 6 It is a circuit diagram showing the semiconductor device according to Embodiment 3. In this embodiment, the delay timer 11 is connected between the gates of INV1 and PM4. The delay timer 11 delays a signal for controlling the drive unit 5 from the abnormality detection unit 9 . As a result, when abnormal operation is detected, NM2 is turned on before switching element Q1 is turned off, and a stable off operation of the second clamp circuit 10 can be realized. Other configurations and effects are the same as those in Embodiment 1.

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PUM

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Abstract

A first clamp circuit 4 clamps a voltage between a gate of a switching element Q1 and a first terminal to a first clamp voltage or lower. A control circuit 2 that controls the switching element Q1 has: a drive unit 5 that drives the switching element Q1; an abnormality detection unit 9 that stops the drive unit 5 when an operation abnormality is detected; and a second clamp circuit 10. At the timeof stopping the drive unit 5 by means of the abnormality detection unit 9, the second clamp circuit 10 clamps the voltage between the gate and the first terminal to a second clamp voltage or lower, said second clamp voltage being lower than the first clamp voltage.

Description

technical field [0001] The present invention relates to semiconductor devices. Background technique [0002] Power semiconductor devices that drive L loads such as transformers are used in ignition systems for internal combustion engines such as automobile engines. Such a semiconductor device has a function of shutting off the main current by detecting abnormal heat generation or a function of shutting off the main current when an ON signal is continuously applied for a certain period of time or more to avoid burnout and damage. This shutdown operation is performed for the self-protection of the semiconductor device, so there is a high possibility that its timing is different from the ignition signal of the engine control computer. Depending on the timing of the shutoff operation, problems such as flashback and knocking of the engine may occur, which may cause damage to the engine mechanism. In order to prevent these situations, it is necessary to implement a slow main cur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02H7/20F02P3/055
CPCH03K17/08128H03K2217/0027H03K17/08122H03K17/163F02P11/00F02P17/12F02P3/0442H02H1/0007H02H7/20
Inventor 上野诚西村一广山本刚司
Owner MITSUBISHI ELECTRIC CORP
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