Processing method of quartz crystal wafer

A technology for quartz wafers and processing methods, applied in liquid cleaning methods, metal processing equipment, cleaning methods and utensils, etc., can solve problems such as the decline of smoothness, and achieve the effect of improving quality and ensuring surface gloss

Pending Publication Date: 2020-09-22
SHENSHAN SPECIAL COOPERATION ZONE YINGDALI ELECTRONICS TECH CO LTD +1
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a processing method for a quartz wafer, which is used to solve the technical problem that the smoothness of the surface of the quartz wafer is reduced due to abrasive friction when the barrel grinding method is adopted in the prior art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Processing method of quartz crystal wafer
  • Processing method of quartz crystal wafer
  • Processing method of quartz crystal wafer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0040] In order to make the purpose, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described The embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts belong to the protection scope of the present invention.

[0041] see figure 1 , the invention discloses a processing method for a quartz wafer, comprising:

[0042] S1. Filling with protective paint, placing the protective paint in the preset area of ​​the quartz wafer to be processed to obtain a coated quartz wafer;

[0043] In the present invention, the quartz wafer 100 to be processed is in the...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to view more

Abstract

The invention relates to a processing method of a quartz crystal wafer. The processing method comprises the steps of feeding a protective coating in a preset area for the quartz crystal wafer to be processed to obtain a coating quartz crystal wafer; feeding the coating quartz crystal wafer into a roller grinding device for roller grinding to obtain a roller grinding quartz crystal wafer; and removing the protective coating in the roller grinding quartz crystal wafer preset area to obtain the finished quartz crystal wafer. By coating the protective coating in the preset area for the quartz crystal wafer to be processed, the surface of the quartz crystal wafer in the preset area can be protected against roller grinding during roller grinding. Accordingly, the inner surface smoothness of thepreset area for the quartz crystal wafer is guaranteed, and the quality of the quartz crystal wafer is improved.

Description

technical field [0001] The invention belongs to the technical field of piezoelectric quartz wafer production, in particular to a processing method for a quartz wafer. Background technique [0002] In order to reduce the energy loss of the small quartz wafer, the shape of the small quartz wafer needs to be ground to suppress the boundary loss. The traditional method is to use tumbling, place the quartz wafer and abrasive materials in a drum of a specific shape, place the drum in a drum machine to rotate, and use centrifugal force to tumble the quartz wafer. [0003] In recent years, the industry has introduced a semiconductor-like processing technology, using etching to process quartz wafers. This method has high equipment and processing costs. Contents of the invention [0004] The invention provides a processing method for a quartz wafer, which is used to solve the technical problem in the prior art that the surface of the quartz wafer is reduced in smoothness due to abr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B24B31/02B05C13/02B08B3/08C23C14/18C23C16/06
CPCB05C13/02B08B3/08B24B31/02C23C14/18C23C16/06
Inventor 蒋振声李小菊姜威谢俊超肖佳彬
Owner SHENSHAN SPECIAL COOPERATION ZONE YINGDALI ELECTRONICS TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap