Silicon connection layer test circuit for testing by using test bare chip
A technology for testing circuits and connecting layers, which is applied in the field of testing circuits for silicon connecting layers, can solve problems such as increased difficulty in chip processing, difficulty in ensuring production yield, and reduced chip production yield, so as to achieve mass production testing and ensure production yield Effect
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[0023] The specific embodiments of the present invention will be further described below in conjunction with the drawings.
[0024] This application provides a silicon connection layer test circuit that uses a test die for testing. The silicon connection layer test circuit includes a silicon connection layer 1 to be tested and a test die 2 for testing the silicon connection layer 1, please refer to figure 1 The silicon connection layer 1 is mainly used for the signal interconnection between the dies in the multi-die device, and the test circuit is used for the test of the silicon connection layer 1 before assembly.
[0025] Among them, please combine figure 2 , The surface of the silicon connection layer 1 is preset with several silicon connection layer input connection points 11 and several silicon connection layer output connection points 12. These connection points are used to connect to the connection points on the surface of the die during assembly. The silicon connection layer...
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