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Integrated photovoltaic module packaging adhesive film

A photovoltaic module packaging and film technology, which is applied in photovoltaic power generation, semiconductor devices, adhesives, etc., can solve the problems of delamination of the backplane, decreased adhesion between white EVA and the backplane and glass, and high prices of inorganic fillers. Adhesion and reduction of the effect of the back sheet lamination process

Pending Publication Date: 2020-10-02
常州斯威克新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are still some shortcomings in white EVA: the uniform distribution of inorganic fillers in white EVA leads to a decrease in the adhesion between white EVA and the backplane and glass; white packaging films in the industry try to increase the content of inorganic fillers to obtain higher reflectivity. But too high inorganic content will lead to delamination from the backsheet
In addition, the price of inorganic fillers in white EVA is relatively high, which limits its cost reduction

Method used

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  • Integrated photovoltaic module packaging adhesive film
  • Integrated photovoltaic module packaging adhesive film
  • Integrated photovoltaic module packaging adhesive film

Examples

Experimental program
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Effect test

preparation example Construction

[0036] above as figure 1 and 3 The preparation method of the integrated photovoltaic module encapsulation film includes the following steps:

[0037] 1. After fully mixing the resin and inorganic filler, co-extrude and granulate through a twin-screw extruder to make masterbatch;

[0038] 2. Put the masterbatch and resin into the mixer and mix them thoroughly for 5-10 minutes, put them into the extrusion hopper, cast them through a single screw or twin screws, and then squeeze them through a structured rubber roller and a smooth rubber roller on the surface, after cooling Get the structured reflective layer 1;

[0039] 3. Add the mixed resin, antioxidant, cross-linking agent, and silane coupling agent into the mixer and mix thoroughly for 5 to 15 minutes. Extrude and cast on the lower surface of the structured reflective layer 1 through a single screw, and Composite with the back plate 3 through rubber rollers;

[0040] 5. After trimming, winding, and packaging processes, a...

Embodiment 1

[0043] A kind of integrated photovoltaic module encapsulation adhesive film of the present invention, such as figure 1 As shown, the structured reflective layer 1, the transition layer 2 and the back plate 3 are arranged sequentially from top to bottom, the upper surface of the structured reflective layer 1 is a planar structure, the thickness of the structured reflective layer 1 is 50 μm, and the material of the structured reflective layer 1 is Inorganic filler and resin, the mass percentage of the inorganic filler is 30%, the mass percentage of the resin is 70%, the inorganic filler is mixed with titanium dioxide and lithopone; the resin is mixed with modified EVA resin and modified PO resin. The lower surface of the structured reflective layer 1 is periodically arranged by a plurality of raised cubes, the raised cubes have a plurality of first raised cubes 11 and a plurality of second raised cubes 12, the first raised cubes 11 and the second raised cubes Cubes 12 are arrang...

Embodiment 2

[0045] A kind of integrated photovoltaic module encapsulation adhesive film of the present invention, such as image 3 As shown, the structural reflection layer 1, the transition layer 2 and the back plate 3 are arranged sequentially from top to bottom, the upper surface of the structural reflection layer 1 is a planar structure, the thickness of the structural reflection layer 1 is 50 μm, and the material of the structural reflection layer 1 is Inorganic filler and resin, the mass percentage of the inorganic filler is 30%, the mass percentage of the resin is 70%, the inorganic filler is mixed with titanium dioxide and lithopone; the resin is mixed with modified EVA resin and modified PO resin. The lower surface of the structured reflective layer 1 has a plurality of first raised cubes 11 and a plurality of second raised cubes 12, the first raised cubes 11 are arranged on the edge of the lower surface of the structured reflective layer 1, and the second raised cubes 12 It is a...

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Abstract

The invention provides an integrated photovoltaic module packaging adhesive film. The integrated photovoltaic module packaging adhesive film comprises a structure reflecting layer, a transition layerand a back plate which are sequentially arranged from top to bottom, the upper surface of the structure reflecting layer is of a plane structure, a plurality of raised cubes are arranged on the lowersurface of the structure reflecting layer, each cube is provided with at least one hole-shaped structure, the upper surface of the transition layer is filled with the hole-shaped structure, gaps between every two adjacent cubes are filled, the lower surface of the transition layer is of a plane structure, and the lower surface of the transition layer is attached to the upper surface of the back plate. The integrated photovoltaic module packaging adhesive film has the advantages of high reflectivity, firm bonding of the reflecting layer and the back plate, simplicity, high efficiency, reductionof a back plate lamination process, and suitableness for large-scale popularization and application.

Description

technical field [0001] The invention belongs to the technical field of the photovoltaic industry, and in particular relates to an integrated packaging adhesive film for photovoltaic modules. Background technique [0002] At present, white EVA is usually selected as the back encapsulation film of single-glass photovoltaic modules to increase the reflection on the back, thereby increasing the power of single-glass modules. However, there are still some shortcomings in white EVA: the uniform distribution of inorganic fillers in white EVA leads to a decrease in the adhesion between white EVA and the backplane and glass; white packaging films in the industry try to increase the content of inorganic fillers to obtain higher reflectivity. But too high inorganic content can cause delamination from the backsheet. In addition, the price of inorganic fillers in white EVA is relatively high, which limits its cost reduction. [0003] Therefore, in view of the above problems, an integra...

Claims

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Application Information

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IPC IPC(8): C09J7/29C09J7/24C09J7/30C09J123/26C09J129/14C09J11/04H01L31/048H01L31/049H01L31/056
CPCC09J7/29C09J7/30C09J123/26C09J129/14C09J11/04H01L31/048H01L31/0481H01L31/049H01L31/056C09J2423/04C09J2423/046C09J2203/326C08K2003/2241C08K2003/2296C08L2205/025C08K2003/3045C08K2003/265C08L23/26C08K3/22C08L29/14C08K3/30C08K3/26Y02E10/52
Inventor 童伟吕松黄宝玉吴丰华吴斌
Owner 常州斯威克新材料科技有限公司
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