A kind of vacuum micro-evaporation molybdenum plating method for diamond particles

A technology of diamond particles and evaporation plating, which is applied in the field of composite materials, can solve the problems of low thermal conductivity of diamond/copper and loose thermal interface bonding, etc.

Active Publication Date: 2021-11-26
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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Problems solved by technology

[0005] In view of the research progress in the prior art, the present invention aims to solve the problem of low thermal conductivity of diamond / copper material and loose thermal conductivity interface, and proposes a vacuum micro-evaporation Mo plating method for diamond / copper composite material. diamond particle method

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  • A kind of vacuum micro-evaporation molybdenum plating method for diamond particles
  • A kind of vacuum micro-evaporation molybdenum plating method for diamond particles
  • A kind of vacuum micro-evaporation molybdenum plating method for diamond particles

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[0027] In order to make the object, technical solution and effect of the present invention clearer and clearer, the following examples are given to further describe the present invention in detail. It should be pointed out that the specific implementations described here are only used to explain the present invention, not to limit the present invention.

[0028] Such as Figure 1~3 Shown, the concrete steps of vacuum microevaporation diamond Mo coating method among the present invention are:

[0029] Step 1: Select Mo powder particles, diamond powder particles, the particle size of the Mo powder particles is 2 μm; the particle size of the diamond particles is 50-200 μm; and weigh 10 g of diamond and 8 g of Mo powder.

[0030] Step 2: cleaning the diamond particles;

[0031] Specific cleaning steps: first put the diamond in an acetone solution, and clean it with ultrasonic vibration for 5-10 minutes. Acetone as an organic solvent can effectively remove the hydrocarbons attach...

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Abstract

The invention discloses a vacuum micro-evaporation molybdenum plating method for diamond particles, which belongs to the technical field of composite materials. The method is specifically as follows: 1. Select Mo powder particles and diamond powder particles, and The molar mass ratio is 10:1, the average particle size of Mo powder particles is 2 μm; the particle size of diamond particles is 50-200 μm; 2. Clean and dry the diamond particles; 3. Ball mill the diamond particles and Mo powder; 4. Put the ball-milled mixture into vacuum micro-evaporation equipment for evaporation, and set the evaporation time and evaporation temperature according to the actual thickness of evaporation; the Mo layer on the surface of the diamond particles plated by the method of the present invention is relatively dense , new carbides are formed and the carbide layer is also dense, high thermal conductivity, low cost, good effect, suitable for laboratory research, and can solve the problem of low thermal conductivity of diamond / copper materials and loose thermal interface bonding .

Description

technical field [0001] The patent of the present invention relates to the technical field of composite materials, in particular to a method for vacuum micro-evaporation molybdenum plating of diamond particles. Background technique [0002] Diamond / copper composite material is a new type of heat sink material with great potential for electronic packaging. The different plating materials and methods of its reinforcement will affect the thermal conductivity of the final diamond-copper composite material to varying degrees. With the continuous development of the domestic electronic chip field, the demand for new electronic packaging materials such as diamond copper by various electronic companies and research centers is gradually increasing. Therefore, how to prepare the thermal conductivity interface between diamond and copper in diamond copper composite materials The problem and the method to improve its thermal conductivity is imminent. [0003] The thermal conductivity of d...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/24C23C14/18C23C14/06
CPCC23C14/0021C23C14/0635C23C14/18C23C14/223C23C14/24
Inventor 王长瑞李治佑李宏钊敬奇田威
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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