Vacuum micro-evaporation molybdenum plating method for diamond particles

A diamond particle, evaporation plating technology, applied in the field of composite materials, can solve the problems of low thermal conductivity of diamond/copper, and the thermal conductivity interface is not tightly combined, and achieves the optimization of the internal thermal conductivity interface, low cost, and improved plating efficiency. Effect

Active Publication Date: 2020-10-02
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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Problems solved by technology

[0005] In view of the research progress in the prior art, the present invention aims to solve the problem of low thermal conductivity of diamond/copper material a

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  • Vacuum micro-evaporation molybdenum plating method for diamond particles
  • Vacuum micro-evaporation molybdenum plating method for diamond particles
  • Vacuum micro-evaporation molybdenum plating method for diamond particles

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Embodiment Construction

[0027] In order to make the object, technical solution and effect of the present invention clearer and clearer, the following examples are given to further describe the present invention in detail. It should be pointed out that the specific implementations described here are only used to explain the present invention, not to limit the present invention.

[0028] Such as Figure 1~3 Shown, the concrete steps of vacuum microevaporation diamond Mo coating method among the present invention are:

[0029] Step 1: Select Mo powder particles, diamond powder particles, the particle size of the Mo powder particles is 2 μm; the particle size of the diamond particles is 50-200 μm; and weigh 10 g of diamond and 8 g of Mo powder.

[0030] Step 2: cleaning the diamond particles;

[0031] Specific cleaning steps: first put the diamond in an acetone solution, and clean it with ultrasonic vibration for 5-10 minutes. Acetone as an organic solvent can effectively remove the hydrocarbons attach...

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Abstract

The invention discloses a vacuum micro-evaporation molybdenum plating method for diamond particles, and belongs to the technical field of composite materials. The method specifically comprises the following steps that 1, Mo powder particles and diamond powder particles are selected, the molar mass ratio of the Mo powder particles to the diamond powder particles is 10: 1, the average particle sizeof the Mo powder particles is 2 microns, and the particle size of the diamond particles is 50-200 microns; 2, the diamond particles are cleaned and dried; 3, the diamond particles and Mo powder are mixed and then subjected to ball milling; and 4, the mixture obtained after ball milling is placed into vacuum micro-evaporation equipment for evaporation, and the evaporation time and the evaporation temperature are set according to the actually required thickness evaporation. According to the vacuum micro-evaporation molybdenum plating method for the diamond particles, the Mo layers on the surfaces of the diamond particles plated through the method are compact, new carbide is formed, the carbide layers are also compact, the heat conductivity is high, the cost is low, the effect is good, the method is suitable for laboratory research, and the problems that the heat conductivity of diamond/ copper materials is low, and the heat conduction interface combination is not tight can be solved.

Description

technical field [0001] The patent of the present invention relates to the technical field of composite materials, in particular to a method for vacuum micro-evaporation molybdenum plating of diamond particles. Background technique [0002] Diamond / copper composite material is a new type of heat sink material with great potential for electronic packaging. The different plating materials and methods of its reinforcement will affect the thermal conductivity of the final diamond-copper composite material to varying degrees. With the continuous development of the domestic electronic chip field, the demand for new electronic packaging materials such as diamond copper by various electronic companies and research centers is gradually increasing. Therefore, how to prepare the thermal conductivity interface between diamond and copper in diamond copper composite materials The problem and the method to improve its thermal conductivity is imminent. [0003] The thermal conductivity of d...

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Application Information

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IPC IPC(8): C23C14/24C23C14/18C23C14/06
CPCC23C14/0021C23C14/0635C23C14/18C23C14/223C23C14/24
Inventor 王长瑞李治佑李宏钊敬奇陈明和谢兰生
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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