Surface acoustic wave filter chip packaging structure and packaging method
A technology of surface acoustic wave filtering and chip packaging structure, which is applied to electrical components, impedance networks, etc., and can solve problems such as poor packaging structure performance and easy cracking
Pending Publication Date: 2020-10-13
FOREHOPE ELECTRONICS NINGBO CO LTD
View PDF0 Cites 1 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
In the cavity structure, the gap between the chip and the substrate is supported by the bump pads of the chip. Therefore, the soldering structure between the bump pads of the chip and the substrate is prone to rupture under the influence of external force, resulting in the failure of the packaging structure. poor performance
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0033] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.
[0034] Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art wi...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention provides a surface acoustic wave filter chip packaging structure and packaging method, and belongs to the technical field of chip packaging. The surface acoustic wave filter chip packaging structure comprises a substrate, welding holes are formed in the plate face of one side of the base plate, the bottoms of the welding holes are electrically connected with a circuit in the substrate, the welding holes are filled with conductive adhesive, protruding block welding spots of the surface acoustic wave filter chip extend into the welding holes to be connected with the conductive adhesive, a working area of the surface acoustic wave filter chip faces the substrate, the surface acoustic wave filter chip surrounds the working area to be connected with the substrate in a sealed mode,and a cavity is formed between the working area and the substrate. The invention aims to provide the surface acoustic wave filter chip packaging structure and packaging method, the connection strength between the bump welding spot of the surface acoustic wave filter chip and the substrate can be enhanced, and thus the probability that the packaging structure is influenced by external force to generate bad effects is reduced.
Description
technical field [0001] The invention relates to the technical field of chip packaging, in particular to a surface acoustic wave filter chip packaging structure and packaging method. Background technique [0002] The surface acoustic wave filter (saw filter) uses piezoelectric crystals such as lithium niobate or lead titanate as the substrate, and two sets of interdigitated metal electrodes with energy conversion function are made by photolithography, that is, the input converter transducer and output transducer. Using the input transducer and the output transducer can convert the input signal of the radio wave into mechanical energy. After processing, the mechanical energy is converted into an electrical signal output to achieve the purpose of filtering unnecessary signals and noise, thereby improving the reception. quality. Due to the product performance and design function requirements of the surface acoustic wave filter, it is necessary to ensure that the functional are...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H03H9/05H03H9/10
CPCH03H9/05H03H9/10
Inventor 徐林华钟磊
Owner FOREHOPE ELECTRONICS NINGBO CO LTD