Photovoltaic module processing method
A processing method and photovoltaic module technology, applied in photovoltaic power generation, sustainable manufacturing/processing, electrical components, etc., can solve the problems of a large proportion of the total number of people in the semi-finished assembly line, uncontrollable manual accuracy, and increased product costs
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Embodiment 1
[0039] refer to Figure 1 to Figure 3 , the invention provides a method for processing a photovoltaic module, comprising the following steps:
[0040] Step S1a: making a semi-finished product; specifically, using the bottom plate 11a, the semi-finished EVA layer 12a, and the silicon wafer 13a to be stacked sequentially from bottom to top and then serially welded to form a semi-finished product 1a;
[0041] Step S2a: making a surface layer, specifically, including step S21a, step S22a, step S23a, step S24a, step S25a, wherein:
[0042] Step S21a: Cut the raw material of the surface layer into sheets, wherein the raw material of the surface layer is PET or glass or ETFE; when the raw material of the surface layer is glass, the cutting size is designed according to the product size;
[0043] Step S22a: preparing customized printing ink;
[0044] Step S23a: printing the surface layer sheet;
[0045] Step S24a: Bake the printed surface layer sheet to obtain the surface layer 2a;...
Embodiment 2
[0054] refer to Figure 4 to Figure 6 , the present invention provides a photovoltaic module processing method, the layered structure of the processed product is as follows Figure 5 , including semi-finished product 1b, sub-surface layer 2b, sub-middle EVA layer 3b, comprising the following steps:
[0055] Step S1b: making a semi-finished product 1b; specifically, using a PCB board 11b and a silicon wafer 13b to be stacked sequentially from bottom to top to form a semi-finished product 1b; specifically, a solder paste layer 12b and a rivet 111b are provided on the PCB board 11b;
[0056] Step S2b: making a surface layer, specifically, including step S21b, step S22b, step S23b, step S24b, and step S25b, wherein:
[0057] Step S21b: cutting the surface layer raw material into surface layer sheets, wherein the surface layer raw material is PET; the size of the surface layer sheet is designed according to the size of the lamination mold 5b;
[0058] Step S22b: preparing customi...
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