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Photovoltaic module processing method

A processing method and photovoltaic module technology, applied in photovoltaic power generation, sustainable manufacturing/processing, electrical components, etc., can solve the problems of a large proportion of the total number of people in the semi-finished assembly line, uncontrollable manual accuracy, and increased product costs

Inactive Publication Date: 2020-10-20
深圳市迪晟太阳能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The appearance of solar energy products is very demanding in the field of civilian products. At present, the method of pasting black tape to cover the busbar, copper strip, and PCB rivet pad in the semi-finished stage has become the mainstream process in the industry. Among them, the stickiness of black tape and manual precision There are uncontrollable risks, high defects, and the high cost of black tape cutting, low efficiency of manual posting, black tape covering the cell leads to lower product output parameters and other factors have always been the technical and cost issues that have plagued various companies in the industry ;
[0004] In the field of ordinary single and polycrystalline solar cells in the photovoltaic industry, the busbar width of the existing cells is between 0.3mm and 2.0mm. In order to effectively reduce the appearance, the width of the black tape used in the industry is 1.5mm-4.5mm , taking the 156*156 five-line as an example, posting black tape leads to a reduction of product efficiency by about 10%, and the labor force for pasting black tape accounts for a large proportion of the total number of people on the semi-finished assembly line, which will undoubtedly greatly increase product costs and greatly reduce customer product experience;
[0005] In addition, in the field of Sunpower and LG solar cell patch in the photovoltaic industry, there are differences in the color of the rivet pad on the front of the single-sided copper clad laminate and the color of the cell, and the color of the PCB bottom plate (for example, the pad is silver-white, the silicon wafer is blue, and the PCB is black. ), resulting in low consistency of product appearance and unsatisfied customers' individual needs

Method used

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Embodiment 1

[0039] refer to Figure 1 to Figure 3 , the invention provides a method for processing a photovoltaic module, comprising the following steps:

[0040] Step S1a: making a semi-finished product; specifically, using the bottom plate 11a, the semi-finished EVA layer 12a, and the silicon wafer 13a to be stacked sequentially from bottom to top and then serially welded to form a semi-finished product 1a;

[0041] Step S2a: making a surface layer, specifically, including step S21a, step S22a, step S23a, step S24a, step S25a, wherein:

[0042] Step S21a: Cut the raw material of the surface layer into sheets, wherein the raw material of the surface layer is PET or glass or ETFE; when the raw material of the surface layer is glass, the cutting size is designed according to the product size;

[0043] Step S22a: preparing customized printing ink;

[0044] Step S23a: printing the surface layer sheet;

[0045] Step S24a: Bake the printed surface layer sheet to obtain the surface layer 2a;...

Embodiment 2

[0054] refer to Figure 4 to Figure 6 , the present invention provides a photovoltaic module processing method, the layered structure of the processed product is as follows Figure 5 , including semi-finished product 1b, sub-surface layer 2b, sub-middle EVA layer 3b, comprising the following steps:

[0055] Step S1b: making a semi-finished product 1b; specifically, using a PCB board 11b and a silicon wafer 13b to be stacked sequentially from bottom to top to form a semi-finished product 1b; specifically, a solder paste layer 12b and a rivet 111b are provided on the PCB board 11b;

[0056] Step S2b: making a surface layer, specifically, including step S21b, step S22b, step S23b, step S24b, and step S25b, wherein:

[0057] Step S21b: cutting the surface layer raw material into surface layer sheets, wherein the surface layer raw material is PET; the size of the surface layer sheet is designed according to the size of the lamination mold 5b;

[0058] Step S22b: preparing customi...

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Abstract

The invention discloses a photovoltaic module processing method. The method comprises the following steps: S1, manufacturing a semi-finished product; S2, manufacturing a surface layer; S3, conductingdie cutting on the incoming EVA roll material to form a middle EVA layer; S4, sequentially laminating the semi-finished product, the middle EVA layer and the surface layer; S5, transferring into a laminating machine for laminating; wherein the step S2 comprises the following sub-steps: step S21, slitting a surface layer raw material into sheets; S22, preparing customized printing ink; S23, printing the surface layer sheet; and S24, baking the printed surface layer sheet, and then obtaining the surface layer. The grid lines and the like are covered in a surface layer printing mode, a manual black tape pasting covering mode in a traditional process is replaced, the covering effect is stable, and manpower and black tape cost are reduced.

Description

technical field [0001] The invention relates to the field of photovoltaic component manufacturing, in particular to a photovoltaic component processing method. Background technique [0002] With the continuous improvement of people's living standards in recent years, green environmental protection has gradually become popular among the people. As a kind of green and renewable energy, civil solar products, on the one hand, bring high-quality product experience when everyone travels. On the other hand, its fashionable shape, diverse The appearance gives customers a sense of beauty. [0003] The appearance of solar energy products is very demanding in the field of civilian products. At present, the method of pasting black tape to cover the busbar, copper strip, and PCB rivet pad in the semi-finished stage has become the mainstream process in the industry. Among them, the stickiness of black tape and manual precision There are uncontrollable risks, high defects, and the high co...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/048H01L31/0216H01L31/18B41M7/00B41M1/30
CPCB41M1/30B41M7/009H01L31/02167H01L31/0481H01L31/1864Y02E10/50Y02P70/50
Inventor 姚飞龙李犹凰
Owner 深圳市迪晟太阳能科技有限公司