Composite piezoelectric substrate and preparation method thereof
A piezoelectric and substrate technology, applied in piezoelectric/electrostrictive/magnetostrictive devices, circuits, electrical components, etc., to solve problems affecting production efficiency
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[0033] In order to solve the problem in the prior art that when the composite piezoelectric substrate is prepared by the deposition method, the deposition chamber needs to be frequently switched and the production efficiency is affected, the present application provides a method for preparing a composite piezoelectric substrate, which includes the following steps:
[0034] Put the silicon wafer into the reaction furnace, alternately circulate the first reaction atmosphere and the second reaction atmosphere into the reaction furnace until the target composite piezoelectric substrate is prepared, and the target composite piezoelectric substrate is included in the In the silicon wafer, the first substrate layer and the second substrate layer are alternately stacked from the outer surface of the silicon wafer inward, wherein the first reaction atmosphere is an oxygen-containing atmosphere or a nitrogen-containing atmosphere, and the second The reaction atmosphere is an oxygen-conta...
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