PRODUCTION METHOD FOR ADDITIVE-MANUFACTURED PRODUCT USING PURE COPPER POWDER HAVING Si COATING

A technology of additive manufacturing and manufacturing method, which is applied in the field of manufacturing of additive manufacturing products, and can solve the problems of difficulty in powder, detachment, and sintering of metal powder.

Active Publication Date: 2020-10-27
JX NIPPON MINING & METALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, at this time, the metal powder is partially sintered due to preheating, and there are problems such as that the powder is not easily detached from the inside of the hole of the molded product during sintering.

Method used

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  • PRODUCTION METHOD FOR ADDITIVE-MANUFACTURED PRODUCT USING PURE COPPER POWDER HAVING Si COATING
  • PRODUCTION METHOD FOR ADDITIVE-MANUFACTURED PRODUCT USING PURE COPPER POWDER HAVING Si COATING
  • PRODUCTION METHOD FOR ADDITIVE-MANUFACTURED PRODUCT USING PURE COPPER POWDER HAVING Si COATING

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1、 comparative example 1

[0125] (Example 1, Comparative Example 1: heat treatment temperature after surface treatment)

[0126] As pure copper powder, prepared by the atomization method with an average particle size (D50) of 72μm and a specific surface area of ​​0.0024m 2 / g of pure copper powder, the pure copper powder is immersed in dilute sulfuric acid aqueous solution, thereby removing the natural oxide film on the surface. Next, after immersing the pure copper powder in a coupling agent aqueous solution (5%) diluted with pure water for 60 minutes, it was dried at 70° C. to 120° C. in a vacuum or in the air. After drying, this pure copper powder was heat-processed at 550 degreeC - 800 degreeC in vacuum (Example 1-1, 1-2). On the other hand, Comparative Examples 1-1 and 1-2 were not heat-treated.

[0127] Table 1 summarizes the Si deposition amount, Si coverage ratio, Si film thickness, C deposition amount, and weight ratio C / Si of the pure copper powder coated by the above treatment.

[0128] A...

Embodiment 2

[0130] (Example 2: Kind of Surface Treatment Agent)

[0131] As pure copper powder, prepared by the atomization method with an average particle size (D50) of 72 μm and a specific surface area of ​​0.0028m 2 / g of pure copper powder, the pure copper powder is immersed in dilute sulfuric acid aqueous solution, thereby removing the natural oxide film on the surface. Next, after immersing the pure copper powder in an epoxysilane aqueous solution (5%) diluted with pure water for 60 minutes, it was dried at 70° C. to 120° C. in a vacuum or in the air. After drying, the pure copper powder was heat-treated at 800° C. in vacuum (Example 2-1). Table 2 summarizes the Si deposition amount, the C deposition amount, and the weight ratio C / Si of the pure copper powder on which the Si coating was formed by the above treatment.

[0132] The verification of "the state of the powder after the sintering test" was performed on these pure copper powders on which the Si coating was formed showed g...

Embodiment 3

[0134] (embodiment 3: the particle diameter of pure copper powder)

[0135] As the pure copper powder, an average particle diameter (D50) of 38 μm produced by an atomization method was prepared, and the pure copper powder was immersed in a dilute sulfuric acid aqueous solution to remove the natural oxide film on the surface. Next, after immersing the pure copper powder in a diaminosilane aqueous solution (5%) diluted with pure water for 60 minutes, it was dried at 70° C. to 120° C. in a vacuum or in the air. After drying, this pure copper powder was heat-treated at 550° C. in vacuum (Example 3-1). Table 3 summarizes the Si deposition amount, the C deposition amount, and the weight ratio C / Si of the pure copper powder on which the Si coating was formed by the above treatment.

[0136] The verification of "the state of the powder after the sintering test" was performed on these pure copper powders on which the Si coating was formed showed good results. Table 3 shows the above ...

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Abstract

A production method for an additive-manufactured product obtained using an electron-beam (EB) additive manufacturing technique in which a first layer is formed by laying down a pure copper powder, preheating the pure copper powder, and subsequently scanning an electron beam thereupon to partially melt and solidify the same, a second layer is formed by laying down the pure copper powder anew upon the first layer, preheating the pure copper powder, and subsequently scanning the electron beam thereupon to partially melt and solidify the same, and building up layers by repeating said operation, said production method characterized in that pure copper powder having a Si coating formed thereupon is used as the pure copper powder, and the preheating temperature is at least 400 DEG C and lower than 800 DEG C. The present invention addresses the problem of providing: a production method for an additive-manufactured product using a pure copper powder having a Si coating formed thereupon, said method making it possible to suppress partial sintering caused by preheating the pure copper powder in EB additive manufacturing, and, when fabricating, suppress a decrease in the degree of vacuum during fabrication caused by carbon (C); and optimal additive manufacturing conditions for the pure copper powder having a Si coating formed thereupon.

Description

technical field [0001] The present invention relates to a method of manufacturing an additively manufactured product using pure copper powder with a Si coating. Background technique [0002] In recent years, attempts have been made to use 3D printing technology to produce metal parts with complex shapes and three-dimensional structures that are considered difficult to form. 3D printing is also called the additive manufacturing (AM) method. It is a method that thinly spreads metal powder on a substrate to form a metal powder layer, scans the metal powder layer with an electron beam or a laser, melts it, and It is solidified, and new powder is spread thinly on it, and it is melted and solidified in the same way, and the above operation is repeated, thereby producing a metal molded article of a complex shape. [0003] In additive manufacturing using an electron beam (EB) method, when metal powder is irradiated with electron beams, charging may occur due to the high electrical ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/00B22F1/02B22F3/105B22F3/16B33Y10/00B33Y70/10B33Y80/00B22F1/05B22F1/16
CPCB22F1/00B22F3/105B22F3/16B33Y70/00B33Y10/00B33Y40/10B33Y80/00Y02P10/25B33Y70/10B22F10/28B22F1/16B22F10/36B22F10/25B22F10/34B22F1/05B33Y50/02B22F2301/10B22F2302/45B22F2304/10B23K15/0086
Inventor 渡边裕文山本浩由涩谷义孝佐藤贤次森冈理千叶昌彦青柳健大
Owner JX NIPPON MINING & METALS CORP
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