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Machining process parameter determination method and device, storage medium and electronic equipment

A technology for determining processing technology and parameters, which is applied to circuits, electrical components, electric solid devices, etc., can solve the problems of low efficiency and poor accuracy of processing parameters determination

Active Publication Date: 2020-10-30
CHANGXIN MEMORY TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present disclosure is to provide a method for determining processing parameters, a device for determining processing parameters, a computer-readable storage medium, and electronic equipment, so as to overcome the low efficiency of determining processing parameters caused by the limitations of related technologies at least to a certain extent , poor accuracy and other technical problems

Method used

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  • Machining process parameter determination method and device, storage medium and electronic equipment
  • Machining process parameter determination method and device, storage medium and electronic equipment
  • Machining process parameter determination method and device, storage medium and electronic equipment

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Embodiment Construction

[0072] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0073] Furthermore, the drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus repeated descriptions thereof will be omitted. Some of the block diagrams shown in the drawings are functional entities and do not necessarily correspond to physically or logically separate entities. These functional entities...

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PUM

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Abstract

The invention relates to the technical field of integrated circuits, and particularly relates to a machining process parameter determination method, a machining process parameter determination device,a computer readable storage medium and electronic equipment. The machining process parameter determination method provided by the embodiment of the invention comprises the steps of obtaining a test image of a test wafer, wherein the test image comprises a local image of each test chip on the test wafer; comparing each local image of the test image with a standard image to obtain a comparison result, and taking the test wafer of which the comparison result meets a first preset condition as an effective wafer; acquiring test data of the effective wafer, wherein the test data comprises test process parameters and key sizes corresponding to the test chips on the effective wafer; and determining test process parameters used as machining process parameters according to the relationship betweenthe key size and the target size. The method has the advantages of high determination efficiency, good accuracy and the like.

Description

technical field [0001] The present disclosure relates to the technical field of integrated circuits, and in particular to a method for determining processing parameters, a device for determining processing parameters, a computer-readable storage medium, and electronic equipment. Background technique [0002] With the development of integrated circuit technology, the integration level of semiconductor chips continues to increase, the critical dimension (Critical Dimension, referred to as CD) of the chip is also continuously reduced to the nanometer level, and the corresponding processing technology is becoming more and more complicated. In the mass production of chips, ensuring the uniformity and stability of critical dimensions is of great significance to stabilizing product yield. [0003] In order to grasp and adjust the processing parameters of the chip in time to achieve parameter optimization and improve product yield, it is generally possible to perform processing test...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/66H01L23/544G06T7/00
CPCH01L22/22H01L22/20G06T7/0004H01L22/30G06T2207/30148G06T2207/20081
Inventor 梁鹏程
Owner CHANGXIN MEMORY TECH INC