Processing method for reducing surface roughness of target

A surface roughness and processing method technology, applied in metal processing equipment, metal material coating technology, manufacturing tools, etc., can solve the problems of target surface damage, reduce target surface roughness, affect surface finish, etc., and achieve reduction Effect of surface roughness, control of surface finish, optimization of milling process parameters

Pending Publication Date: 2020-11-06
合肥江丰电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] During the mechanical processing of the target, due to the excessive milling strength of the tool on the processing surface, it will rub against the sputtering surface, resulting in damage to the target surface and affecting the surface finish. Therefore, it is necessary to improve the existing processing technology to reduce the target surface. material surface roughness

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] This embodiment provides a processing method for reducing the surface roughness of the target. Milling is performed on the G6 split LCD planar target. The processing method includes:

[0049] (1) Roughly process the surface of the target, and reduce the surface roughness of the target to 0.9 μm by controlling the feed rate to 800mm / min, the cutting amount to 0.2mm and the tool speed to 1000r / min;

[0050] (II) Perform semi-finishing on the surface of the target material after rough machining, and reduce the surface roughness of the target material to 0.54 μm by controlling the feed rate to 800 mm / min, the cutting amount to 0.2 mm and the tool speed to 1000 r / min ;

[0051] (Ⅲ) Finishing the surface of the target after semi-finishing, by controlling the feed rate to 80mm / min, the cutting amount to 0.02mm and the tool speed to 1000r / min, the surface roughness of the target is reduced to 0.16μm .

[0052] The surface roughness data after finishing are summarized in Table...

Embodiment 2

[0054] This embodiment provides a processing method for reducing the surface roughness of the target. Milling is performed on the G8.5 split LCD planar target. The processing method includes:

[0055] (1) Roughly process the surface of the target, and reduce the surface roughness of the target to 0.87 μm by controlling the feed rate to 900 mm / min, the cutting amount to 0.3 mm, and the tool speed to 1100 r / min;

[0056] (II) Perform semi-finishing on the surface of the target after rough machining, and reduce the surface roughness of the target to 0.48 μm by controlling the feed rate to 900 mm / min, the cutting amount to 0.3 mm and the tool speed to 1100 r / min ;

[0057] (Ⅲ) Finishing the surface of the target after semi-finishing, by controlling the feed rate to 90mm / min, the cutting amount to 0.03mm and the tool speed to 1100r / min, the surface roughness of the target is reduced to 0.15μm .

[0058] The surface roughness data after finishing are summarized in Table 1.

Embodiment 3

[0060] This embodiment provides a processing method for reducing the surface roughness of the target. Milling is performed on the G10.5 split LCD planar target. The processing method includes:

[0061] (1) Roughly process the surface of the target, and reduce the surface roughness of the target to 0.85 μm by controlling the feed rate to 1000mm / min, the cutting amount to 0.3mm and the tool speed to 1200r / min;

[0062] (II) Perform semi-finishing on the surface of the target after rough machining, and reduce the surface roughness of the target to 0.46 μm by controlling the feed rate to 1000 mm / min, the cutting amount to 0.3 mm and the tool speed to 1200 r / min ;

[0063] (Ⅲ) Finish the surface of the target after semi-finishing, and reduce the surface roughness of the target to 0.13 μm by controlling the feed rate to 100 mm / min, the cutting amount to 0.05 mm, and the tool speed to 1200 r / min.

[0064] The surface roughness data after finishing are summarized in Table 1.

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Abstract

The invention provides a processing method for reducing the surface roughness of a target. The processing method comprises: adopting different milling process parameters to perform rough processing, semi-finish processing and finish processing on the surface of the target in sequence; in the rough processing flow, reducing the surface roughness Ra of the target to be 1.0 microns or less by controlling the milling process parameters; in the semi-finish processing flow, further reducing the surface roughness of the rough-processed target to 0.6 microns or less by controlling the milling processparameters; and in the finish processing flow, further reducing the surface roughness of the semi-finish-processed target to 0.2 microns or less by controlling the milling process parameters. By optimizing the milling process parameters, the surface smoothness of the machined target can be effectively controlled, the surface roughness of the target is reduced, and the normal use of the target in the sputtering process is guaranteed.

Description

technical field [0001] The invention belongs to the technical field of target material processing and relates to a processing method for reducing the surface roughness of a target material. Background technique [0002] Magnetron sputtering is a substrate coating process that uses charged particles to bombard the target, so that the target atoms escape from the surface and are evenly deposited on the substrate. Magnetron sputtering has become the most excellent substrate coating process due to its advantages of high sputtering rate, low substrate temperature rise, good film-substrate bonding force, and excellent metal coating uniformity and strong controllability. It is widely used in the coating process of electronic and information industries such as integrated circuits, information storage, liquid crystal display, laser memory, electronic control devices, etc. [0003] With the rapid development of the electronic information industry, such as in the manufacturing process...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23C3/00B23C5/08C23C14/35
CPCB23C3/00B23C5/08C23C14/3407C23C14/35
Inventor 姚力军窦兴贤王学泽王青松闫安
Owner 合肥江丰电子材料有限公司
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