Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Double-layer high-strength flexible circuit board with internal reinforcing mechanism

A flexible circuit board and circuit board technology, applied in the directions of printed circuits, circuit thermal devices, printed circuit components, etc., can solve the problems of increasing the strength and toughness of the circuit board, reducing the heat dissipation effect, increasing the reinforcing plate, etc. Strength and toughness, protection from high temperature damage, effect of increasing service life

Active Publication Date: 2020-11-06
深圳市腾鑫精密电子芯材科技有限公司
View PDF5 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Since the double-layer flexible circuit board needs to be installed with electronic components on both sides, the double-sided flexible circuit board cannot add a reinforcing plate on the back to increase the strength and toughness of the circuit board like a single-layer circuit board. The reinforcement structure is added to the inner side of the board, but adding the reinforcement structure from the inner layer will reduce the air permeability and heat dissipation effect of the circuit boards on both sides, resulting in the inability of the circuit board to dissipate heat reasonably during use, resulting in high temperature affecting the use of the circuit board, and now Some double-layer flexible circuit boards cannot be effectively positioned when the reinforcement structure is added, which may cause the flexible circuit board to slide on both sides of the reinforcement structure, affecting the use effect, and the strength of the flexible circuit board itself cannot be guaranteed, and may break. For this reason, the present invention proposes a double-layer high-strength flexible circuit board with internal reinforcement mechanism to solve the above problems

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Double-layer high-strength flexible circuit board with internal reinforcing mechanism
  • Double-layer high-strength flexible circuit board with internal reinforcing mechanism
  • Double-layer high-strength flexible circuit board with internal reinforcing mechanism

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0016] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0017] see Figure 1 to Figure 3 , the present invention provides a technical solution: a double-layer high-strength flexible circuit board with an internal reinforcement mechanism, including a circuit board 1, a reinforcement board 3 and a heat dissipation structure, and the circuit board 1 is bonded to the On the outer side of the reinforcement board 3, the reinforcement board 3 and the circuit board 1 are fixedly connected to both sides of the heat dissipat...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of circuit boards, in particular to a double-layer high-strength flexible circuit board with an internal reinforcing mechanism. The double-layer high-strength flexible circuit board comprises a circuit board, a reinforcing plate and a heat dissipation structure, and the circuit board is adhered to the outer side of the reinforcing plate through an adhesive; the reinforcing plate and the circuit board are fixedly connected to the two sides of the heat dissipation structure through positioning screws; the heat dissipation structure comprises heat-conducting plates, a plurality of uniformly distributed heat-conducting columns protrude from the outer sides of two ends of the heat-conducting plates; the heat-conducting columns penetrate through the reinforcing plate and is connected with the circuit board; and supporting columns are welded between the heat conducting plates. The beneficial effects are that: a reinforcing structure and a heat dissipation structure can be added between the two layers of flexible circuit boards, the strength and toughness of the flexible circuit board can be improved through the reinforcing structure, the protection effect is improved, the heat dissipation effect between the circuit boards can be improved through the heat dissipation structure, the use effect of the circuit boards is prevented from being affected by high temperature, the circuit boards are protected against high-temperature damage, and the heat dissipation structure can also achieve the effect of improving the strength of the circuit boards.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a double-layer high-strength flexible circuit board with an internal reinforcing mechanism. Background technique [0002] Flexible Printed Circuit (FPC) is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film as the base material. It has the characteristics of high wiring density, light weight, thin thickness and good bendability. A double-layer flexible circuit board is a combination of two-layer flexible circuit boards. [0003] Since the double-layer flexible circuit board needs to be installed with electronic components on both sides, the double-sided flexible circuit board cannot add a reinforcing plate on the back to increase the strength and toughness of the circuit board like a single-layer circuit board. The reinforcement structure is added to the inner side of the board, but adding the reinforcement structure from t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K1/02H05K1/14
CPCH05K1/0281H05K1/0209H05K1/02H05K1/0206H05K1/0271H05K1/147
Inventor 王跃杰肖引珍
Owner 深圳市腾鑫精密电子芯材科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products