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Crimping type semiconductor device, crimping sub-module and elastic temperature measurement packaging assembly

A technology of packaging components and sub-modules, which is applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc., can solve the problems of temperature measurement structure damage and difficult measurement of junction temperature, and achieve simple installation and high accuracy High, simple calculation method

Active Publication Date: 2020-11-10
GLOBAL ENERGY INTERCONNECTION RES INST CO LTD +2
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The purpose of the present invention is to provide a crimping type semiconductor device, a crimping sub-module and an elastic temperature measuring package assembly to solve the problem that the junction temperature in the prior art is difficult to measure, and the direct measurement of the temperature sensor may lead to the temperature measuring structure Damaged technical issues

Method used

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  • Crimping type semiconductor device, crimping sub-module and elastic temperature measurement packaging assembly
  • Crimping type semiconductor device, crimping sub-module and elastic temperature measurement packaging assembly
  • Crimping type semiconductor device, crimping sub-module and elastic temperature measurement packaging assembly

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Embodiment approach

[0070] The top of the probe fixing member 342 extends outwards with a first limiting boss, and the inside of the limiting sleeve 343 extends toward the probe fixing member 342 with a second limiting boss, and the elastic member 344 covers It is arranged on the outer side of the probe fixing member 342 , and the two ends of the elastic member 344 abut against the first limiting boss and the second limiting boss respectively. The elastic member 344 is directly sleeved on the outside of the probe fixing member 342, and the position of the elastic member 344 is adjusted by the combination of the first limiting boss protruding from the outer side of the probe fixing member 342 and the second limiting boss at the bottom of the limiting sleeve 343. It is defined so that the probe fixing member 342 can expand and contract inside the limiting sleeve 343 .

[0071] Or, it is also possible to directly extend a limit boss in the inside of the limit sleeve 343 towards the middle, or the bo...

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Abstract

The invention provides a crimping type semiconductor device, crimping sub-modules and an elastic temperature measurement packaging assembly, the crimping type semiconductor device comprises a plurality of crimping sub-modules, and the elastic temperature measurement packaging assembly is attached to a chip assembly and is used for measuring the temperature of a chip and includes a temperature measuring for being attached to the chip assembly for temperature measurement, a probe fixing piece for fixing the temperature measuring probe, and a limiting sleeve outside the proble fixing piece; the probe fixing piece is arranged in the limiting sleeve in a sliding mode, the top end of the limiting sleeve can abut against the chip assembly, and an elastic piece is arranged in the limiting sleeve.The temperature measurement probe can be directly attached to the chip assembly, so that contact type temperature measurement is realized, intuitive and effective temperature measurement of an internal chip of the crimping type semiconductor device is achieved, the temperature measurement requirement of the crimping type semiconductor device is met, the accuracy is relatively high, the use area isrelatively wide, the calculation mode is relatively simple, and the electrical insulating property is good, and the interference of the external environment is avoided.

Description

technical field [0001] The invention relates to the technical field of temperature measurement of semiconductor devices, in particular to a crimping type semiconductor device, a crimping sub-module and an elastic temperature measuring package assembly. Background technique [0002] For crimp-type semiconductor devices with multiple chips connected in parallel in a large scale, due to the interaction of various internal physical fields, there will be differences in the junction temperature of each chip, which will affect the performance and reliability of the device, and become a constraint to improve the power level of the device. one of the important factors. Therefore, accurate measurement of the junction temperature of each chip has become one of the most concerned issues in the application of crimp-type semiconductor devices. [0003] At present, the existing methods for obtaining the internal junction temperature of crimp-type semiconductor devices generally include th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01K1/14H01L23/34
CPCG01K1/14H01L23/34
Inventor 张雷陈中圆李尧圣李翠杨晓亮吴军民
Owner GLOBAL ENERGY INTERCONNECTION RES INST CO LTD
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