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Display substrate, manufacturing method thereof and display panel

A display substrate and display area technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve problems such as Ag precipitation and lower product quality

Active Publication Date: 2020-11-13
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Then, when the anode is formed by wet etching, the Al in the edge of the binding terminal will be etched by the silver etching solution to form an undercut (undercut); at the same time, after the Al is etched by the silver etching solution, Ag will be precipitated. The precipitated Ag can cause a short circuit between two adjacent binding terminals or move to the display area to produce a GDS (Growing Dark Spot, growing black spot) phenomenon, thereby reducing product quality

Method used

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  • Display substrate, manufacturing method thereof and display panel
  • Display substrate, manufacturing method thereof and display panel
  • Display substrate, manufacturing method thereof and display panel

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] An embodiment of the present invention provides a display substrate, including a binding region, referring to figure 1 As shown, the binding area includes a substrate and a plurality of binding units 1 located on the substrate, refer to figure 2 and image 3 As shown, the binding unit includes:

[0048] The binding part, the binding part includes a first interlayer dielectric layer 32 and a binding terminal 31 , and the binding terminal 31 covers the first interlayer dielectric layer 32 .

[0049] The first flat part 5 , the first flat part 5 covers at least part of the edge of the binding terminal 31 .

[0050] The above binding terminals can be used for subsequent binding with chip terminals. The bonding terminal may include a two-layer laminated structure, for example: a titanium layer and an aluminum layer, wherein the aluminum layer is in contact with the first interlayer dielectric layer; it may also include a three-layer laminated structure, for example: a firs...

Embodiment 2

[0095] An embodiment of the present invention provides a display panel, including the display substrate provided in the first embodiment.

[0096] The display panel may be a flexible display panel or a rigid display panel, which is not limited here. The display panel may be an OLED (Organic Light-Emitting Diode, Organic Light-Emitting Diode) display panel, and any product or component with a display function such as a TV, a digital camera, a mobile phone, and a tablet computer including an OLED display panel. The OLED display panel may be a top-emission OLED display panel or a bottom-emission OLED display panel, which is not limited here.

Embodiment 3

[0098] An embodiment of the present invention provides a method for manufacturing the display substrate of Embodiment 1, the method includes:

[0099] S01. Form a binding part. The binding part includes a first interlayer dielectric layer and a binding terminal, and the binding terminal covers the first interlayer dielectric layer.

[0100] S02. Form a first flat portion, where the first flat portion covers at least part of the edge of the binding terminal.

[0101] In the display substrate formed by this method, the first flat part covers at least part of the edge of the binding terminal, and in the subsequent etching process, the first flat part can at least prevent the part of the edge of the binding terminal from directly contacting the etching solution. , so as to effectively prevent the edge of the bonding terminal covered by it from being etched, thereby improving product quality. ,

[0102] Optionally, the display substrate further includes a groove; before S02, form...

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Abstract

The invention provides a display substrate, a manufacturing method thereof and a display panel, and relates to the technical field of display, and the display substrate can effectively prevent the edge of a binding terminal from being etched, thereby improving the product quality. The display substrate comprises a binding area, the binding area comprises a substrate body and a plurality of bindingunits located on the substrate body, each binding unit comprises a binding part, each binding part comprises a first interlayer dielectric layer and a binding terminal, and each binding terminal covers the corresponding first interlayer dielectric layer; and the first flat part at least covers a part of the edge of the binding terminal. The manufacturing method is suitable for manufacturing the display substrate.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a display substrate, a manufacturing method thereof, and a display panel. Background technique [0002] OLED (Organic Light-Emitting Diode, Organic Light-Emitting Diode) display products have gradually occupied the consumer market due to the advantages of low power consumption, wide color gamut, thinness, and shapeability, and are widely used in portable electronics, wearable devices, and instant messaging. , virtual reality and other fields. [0003] An OLED display panel includes a display area and a binding area (pad). The binding area includes binding terminals electrically connected to chip terminals, and the display area includes thin film transistors and OLED light emitting units. The binding terminal is generally arranged on the same layer as the source and drain (SD) of the thin film transistor. In order to obtain lower resistance, the source and drain electr...

Claims

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Application Information

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IPC IPC(8): H01L27/32H01L21/77
CPCH10K59/35H10K59/131H10K59/1201
Inventor 宋尊庆陈登云
Owner BOE TECH GRP CO LTD