Light emitting module and packaging method thereof

Abstract

The invention discloses a light emitting module and a packaging method thereof, and belongs to the technical field of lasers, and the light emitting module comprises: a substrate which comprises a first surface and a second surface; and a second surface located at the substrate, wherein a VCSEL laser chip and a driving chip are located on the second face of the substrate and sequentially arrangedin the first direction, the VCSEL laser chip is electrically connected with the driving chip, the driving chip is electrically connected with a bonding pad on the second surface of the substrate, a through hole is formed in the substrate, the through hole is used for exposing light emitted by the VCSEL laser chip, and the first direction is a direction in which the first surface of the substrate vertically points to the second surface. Therefore, the distance of the electric loop is shortened, corners of the electric loop are eliminated, technological processes such as wire bonding are eliminated, technological steps are simplified, and self-inductance of the electric loop is reduced.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of lasers, and in particular to a light emitting module and a packaging method thereof. Background technique [0002] TOF (time of flight, time of flight) technology obtains spatial three-dimensional information by measuring the time difference between the signal light emission and the received signal after the signal light is reflected. Applications such as automatic driving, face recognition, and space modeling based on TOF technology are developing rapidly. In the light emitting module, VCSEL (Vertical Cavity Surface Emitting Laser, vertical cavity surface emitting laser) is a commonly used light source. In addition, it needs the cooperation of drive chips, capacitors, switches and other components, so that VCSEL can emit optical pulse signals that meet the requirements of distance measurement. Usually, these components are packaged on the substrate through surface assembly technolo...

AI Technical Summary

Problems solved by technology

But in reality, the presence of inductance in the electrical circuit where the VCSEL is located will delay the electric pulse drive and increase the rise and fall

And the electrical circuit is too long, the arrangement is unreasonable or there are corners and other factors will increase the inductance

Therefore, the rising and falling edges of the optical signal will also increase, and in some cases, the pulse width and peak power will also be greatly affected

Images