Compatible polishing treatment device for polycrystalline silicon scrap tailings

Abstract

The invention discloses a compatible polishing treatment device for polycrystalline silicon edge skin tailings. The device includes a box body, wherein universal wheels are mounted at four corners ofthe bottom of the box body; a platform is welded to the center of the inner wall of the box body in the horizontal direction, a mounting groove is formed in the center of the top of the platform, a first grinding piece is rotatably connected to the inner wall of the mounting groove, a first motor is mounted in the center of the bottom of the first grinding piece, and a second motor is mounted in the center of the top of the box body. By installing the grinding device, the top face and the bottom face of polycrystalline silicon can be subjected to two-way grinding, the grinding efficiency is improved, and the grinding effect of different depths is achieved by adjusting the rotating speed of a grinding load or a grinding tool; the grinding fluid is adopted for cooling and lubricating the grinding tool, the service life of the grinding tool is greatly prolonged, the consumable cost is reduced, meanwhile, the grinding fluid can take away abrasive dust, flying dust is avoided, recycling ofthe grinding fluid is achieved through the filtering and collecting device, and resource waste is avoided.

Description

technical field [0001] The invention relates to the technical field of a compatible grinding treatment device for polysilicon trim and tailings, in particular to a compatible grinding device for polysilicon trim and tailings. Background technique [0002] Polysilicon crystal growth is an important link in the production process of polysilicon solar cells. In order to control the manufacturing cost of polysilicon solar cells, a large proportion of the silicon materials used for the growth of polysilicon crystals are scraps, heads and tails of polysilicon ingots. The quality of these polysilicon recycled materials is crucial to the quality of subsequent polysilicon crystals. Important, at present, in order to further reduce the manufacturing cost of polysilicon solar cells and improve the photoelectric conversion efficiency of polysilicon solar cells, diamond wire cutting polysilicon wafer technology has become an extremely important part of the production process of polysilic...

AI Technical Summary

Problems solved by technology

Manual grinding has a lot of dust, which is harmful to the environment and human body, and because the dry grinding diamond particles are easily detached from the grinding disc, the life of the diamond grinding disc is extremely short and the wear is huge

In addition, since hard impurities are mainly concentrated on the surface of recycled materials at a depth of 1-5mm, the depth of manual grinding is usually only 0.1-0.3mm, so these hard impurities cannot be effectively removed, and the diamond grinding disc needs to be cooled and lubricated. In order to prevent waste of resources when using polishing fluid, it is necessary to recycle the polishing fluid to save resources

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