Unsealing device and method for ceramic cavity glass cover plate structure device

Abstract

The invention relates to an unsealing device and method for a ceramic cavity glass cover plate structure device. The device comprises a base, a bracket, an operating table and a solvent box, wherein aguide rail is fixed on the bracket, and the sliding block moves along the guide rail; the sliding block, the connecting rod, the tension sensor and the switching assembly are sequentially connected from top to bottom; the solvent box is located under the switching assembly, the signal output end of the tension sensor is connected with the signal input end of the programmable controller, and the signal output end of the programmable controller is connected with the control signal input end of the alarm and the control signal input end of the motor. The method comprises the following steps: measuring the thickness of the glass cover plate; bonding and fixing a to-be-unsealed device; arranging the solvent box right below the device to be unsealed; clicking descending to enable the to-be-unsealed device to vertically move downwards until the alarm is given; setting a stroke; clicking descending again to enable the to-be-unsealed device to move downwards to the end point of the stroke; after 15-20 minutes, clicking ascending till the unsealing device leaves the solvent box. The device is simple in structure, convenient to operate, accurate in control, and high in safety and reliability.

Description

technical field [0001] The invention relates to the destructive physical analysis of semiconductor devices, in particular to an unsealing device for devices with a ceramic cavity glass cover plate structure. Background technique [0002] The ceramic cavity glass cover plate structure device is a sealing device in which the semiconductor chip is bonded to the bottom of the ceramic cavity cavity, and then a glass cover plate is bonded to the ceramic cavity. This kind of packaging structure device is mostly an optoelectronic semiconductor device , widely used in production and life. Military, aviation, and aerospace fields require high reliability and high safety for the assembly of ceramic cavity glass cover plate structural devices. Therefore, destructive physical analysis must be carried out before use. As an indispensable key process in destructive physical analysis, device unsealing will directly affect the development of subsequent tests, especially the analysis and eval...

AI Technical Summary

Problems solved by technology

The former uses mechanical means to separate the glass cover from the ceramic cavity, which inevitably breaks the glass cover, and the fragments are easy to fall into the ceramic cavity, often causing damage to the internal structure of the device; the latter uses hydrofluoric acid to corrode the glass cover , although it is unlikely that the device will be damaged due to glass fragments, it is not easy to control it properly. If hydrofluoric acid flows into the ceramic cavity, it will corrode and damage the semiconductor chip. At the same time, there is a certain danger in using hydrofluoric acid at close range.

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