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Transceiving assembly and electronic equipment

A technology of transceiver components and transceiver equipment, applied in the field of radar, can solve the problems of unfavorable component miniaturization, low space utilization rate, complex process technology, etc., and achieve the effect of cheap processing price, compact and reasonable layout, and simple structural design

Inactive Publication Date: 2020-11-27
CHENGDU T-RAY TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The traditional brick-type T / R module structure has a large longitudinal dimension, and the overall space utilization rate is low, which is not conducive to the miniaturization of modules
The assembly of the traditional tile-type T / R component structure is relatively complicated, and its process technology is more complicated and the cost is high

Method used

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  • Transceiving assembly and electronic equipment
  • Transceiving assembly and electronic equipment
  • Transceiving assembly and electronic equipment

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Embodiment Construction

[0040] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.

[0041] Accordingly, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art wi...

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Abstract

The embodiment of the invention provides a transceiving assembly and electronic equipment, and relates to the technical field of radars. The transceiving assembly comprises a radio frequency unit, a distribution unit and a multi-layer printed circuit board, the distribution unit is electrically connected with the radio frequency unit and the control equipment, the radio frequency unit is connectedwith first transceiving equipment and second transceiving equipment, and the distribution unit and the radio frequency unit are arranged on the multi-layer printed circuit board; the distribution unit receives a control instruction and a power supply voltage provided by the control equipment; the radio frequency unit processes a first radio frequency signal provided by the first transceiver according to the control instruction and the power supply voltage to obtain a processed first radio frequency signal, and transmits the processed first radio frequency signal to the second transceiver; andthe radio frequency unit processes a second radio frequency signal provided by the second transceiver according to the control instruction and the power supply voltage to obtain a processed second radio frequency signal, and transmits the processed second radio frequency signal to the first transceiver. The transceiving assembly and the electronic equipment have the advantages of low cost and high integration level.

Description

technical field [0001] The present invention relates to the technical field of radar, in particular to a transceiver component and electronic equipment. Background technique [0002] With the rapid development of microwave and millimeter wave integrated circuits, people's requirements for miniaturization, low weight, low cost and high reliability of T / R (Transmitter and Receiver, receiving and sending) components are becoming higher and higher. [0003] Common T / R components have two basic array structures, namely "brick" and "tile". The traditional brick-type T / R module structure has a large longitudinal dimension, and the overall space utilization rate is low, which is not conducive to the miniaturization of the module. The assembly of the traditional tile-type T / R component structure is relatively complicated, and its process technology is more complicated and the cost is high. Contents of the invention [0004] Objects of the present invention include, for example, p...

Claims

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Application Information

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IPC IPC(8): H04B1/40H01Q1/36H01Q1/38
CPCH01Q1/36H01Q1/38H04B1/40
Inventor 周鹏张成军罗烜刘会奇郭凡玉
Owner CHENGDU T-RAY TECH CO LTD
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