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Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device

A technology of resin composition and resin, applied in semiconductor devices, synthetic resin layered products, semiconductor/solid-state device manufacturing, etc., can solve problems such as operability deterioration

Inactive Publication Date: 2020-11-27
MITSUBISHI GAS CHEM CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, with the miniaturization and high performance of semiconductor devices, the narrowing of the pitch of the electrodes arranged on the chip and the narrowing of the gap between the electrodes are advancing. The occurrence of poor filling such as deterioration and non-filling becomes a problem

Method used

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  • Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device
  • Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device
  • Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0305] As the benzoxazine compound (A), a MEK solution (50% by mass of non-volatile content) of the benzoxazine compound of the aforementioned general formula (5-1) (P-d type benzoxazine produced by Shikoku Chemical Industry Co., Ltd.) ) 160 parts by mass (80 parts by mass in terms of non-volatile components), dehydroabietic acid (molecular weight: 300.44, pKa: 4 to 5, functional group equivalent of acidic site: 300g / eq., manufactured by Wako Pure Chemical Industries, Ltd.), 40 parts by mass of MEK solution (50% by mass of non-volatile content) (20 parts by mass in terms of non-volatile content), as the thermosetting component (C) R in the aforementioned formula (8) 11 All hydrogen atoms, n 4 10 parts by mass of a maleimide compound (BMI-2300, manufactured by Daiwa Chemical Industry Co., Ltd.) of 1 to 3 (non-volatile content: 50% by mass) in MEK (5 parts by mass in terms of non-volatile content) , and the maleimide compound shown in the aforementioned formula (9) (n in the a...

Embodiment 2

[0307] 80 parts by mass of the benzoxazine compound of the aforementioned general formula (5-1) as the benzoxazine compound (A) was changed to 20 parts by mass in terms of non-volatile components, and the thermosetting component (C) 5 parts by mass of the maleimide compound of the aforementioned formula (8) was changed to 45 parts by mass in terms of non-volatile components, and 15 parts by mass of the maleimide compound of the aforementioned formula (9) was changed to 45 parts by mass in terms of non-volatile components. 25 parts by mass in terms of component conversion, and 10 parts by mass of an acrylic polymer (mass average molecular weight: 2900, ARUFON (registered trademark) US-6170 manufactured by Toagosei Co., Ltd.) as a flexibility-imparting component (F) was mixed. Except that, it carried out similarly to Example 1, the varnish was prepared, and the resin laminated body was obtained.

Embodiment 3

[0309] As the thermosetting component (C), instead of the maleimide compound of the aforementioned formula (8) and the maleimide compound of the aforementioned formula (9), dipentaerythritol hexaacrylate (Nippon Kayaku Co., Ltd. DPHA) 20 parts by mass, as a radical polymerization initiator, instead of dicumyl peroxide, changed to tert-butyl hydroperoxide (LUPEROX TBH manufactured by ARKEMA Yoshitomi, Ltd., 10-hour half-life temperature: 165°C) 0.5 mass parts, except that, it was carried out in the same manner as in Example 1 to prepare a varnish and obtain a resin laminate.

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PUM

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Abstract

Provided is a resin composition which has excellent adhesion to substrates such as chips and printed circuit boards and has excellent flux activity. This resin composition comprises a benzoxazine compound (A), an organic compound (B) having a flux function, and at least one thermosetting component (C) selected from a phenol resin and a radically polymerizable thermosetting resin, wherein the radically polymerizable thermosetting resin is a resin or a compound having one or more functional groups selected from the group consisting of an alkenyl group, a maleimide group, and a (meth)acryloyl group, and the mass ratio ((A) / (C)) of the benzoxazine compound (A) to the thermosetting component (C) is 20 / 80 to 90 / 10.

Description

technical field [0001] The present invention relates to a resin composition, a laminate using the resin composition, a semiconductor wafer with a resin composition layer, a semiconductor mounting substrate with a resin composition layer, and a semiconductor device. Specifically, the present invention relates to a resin composition useful as an underfill material. Background technique [0002] In recent years, with the miniaturization and high performance of semiconductor devices, semiconductor chips (hereinafter, sometimes abbreviated as "chips") are mounted on semiconductor mounting substrates (hereinafter, sometimes abbreviated as "substrates"). method, flip-chip mounting has received attention. In flip-chip mounting, generally, there is a process of bonding a chip to a substrate, filling the gap between the chip and the substrate with an underfill material and curing it. However, with the miniaturization and high performance of semiconductor devices, the narrowing of th...

Claims

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Application Information

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IPC IPC(8): H01L21/60B32B27/34C08F2/44C08F22/06H01L23/29H01L23/31
CPCC08F2/44C08F222/106C09D133/04H01L23/293C08L79/02C08G73/0233C08G73/12C08L79/085C08K3/34C08K5/09C08K5/14C08L33/00C08K5/544C08K5/1539C08K5/29C08L79/08C08K5/00C08K5/357C08K3/013C08K3/36C08K2201/005B32B27/281C08K5/42C08K2201/003C08L35/02C08L39/00C08L61/04H01L23/295H01L24/29H01L2224/2919H01L2224/2929H01L2924/0635
Inventor 东口鉱平泷口武纪冈庭正志木田刚
Owner MITSUBISHI GAS CHEM CO INC