Transfer device

A technology for transferring equipment and bonding glue, which is applied in the manufacture of conveyor objects, electrical components, semiconductor/solid-state devices, etc., and can solve the problem that LEDs cannot be transferred to display backplanes, etc.

Pending Publication Date: 2020-12-01
CHENGDU VISTAR OPTEOLECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The invention provides a transfer device to overcome the problem that some LEDs cannot be transferred to the display backplane in the prior art

Method used

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Embodiment Construction

[0032] The specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and the present invention is not limited to the following specific embodiments.

[0033] At present, in the transfer process of LED chips, in order to facilitate the receiving of LED chips, the surface of the temporary substrate is usually provided with an adhesive layer with high adhesion. However, when transferring the LED chips from the temporary substrate to the display backplane, too high Adhesive force will cause some LED chips to be adhered to the adhesive layer, resulting in transfer failure.

[0034] figure 1 It is a structural schematic diagram of the transfer device of the present invention; figure 2 for figure 1 Schematic diagram of the structure of the temporary substrate; image 3 It is a schem...

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Abstract

The present invention provides a transfer device, comprising: a temporary substrate provided with a plurality of through holes; a bonding glue layer which is arranged on the surface of the temporary substrate, wherein the bonding glue layer covers the plurality of through holes, and the bonding glue layer is used for receiving the LED chips, so that the LED chips are in one-to-one correspondence with the through holes; and a pressure device which is connected with the plurality of through holes, wherein the pressure device is used for increasing or decreasing the pressure of the fluid medium in the through holes, so that part of the bonding adhesive layer covering the through holes deforms under the action of the pressure of the fluid medium. According to the transfer device, the bonding glue layer covering the through hole can fluctuate up and down under the pressure effect of the fluid medium through the pressure device, so that the adhesive capacity between the LED bonding glue layers is reduced, and the pickup equipment can pick up and transfer an LED conveniently.

Description

technical field [0001] The invention relates to the technical field of micro-light-emitting diode manufacturing, in particular to a transfer device for micro-light-emitting diodes. Background technique [0002] Micro Light Emitting Diode (Micro LED) is a device with a size ranging from several microns to hundreds of microns. Because it is much smaller than ordinary LEDs, a single Micro LED is used as a pixel for display become possible. [0003] When manufacturing Micro-LEDs, it is usually necessary to first form the LED chip on the substrate, then flip it upside down on the temporary substrate so that the substrate is above the LED chip, then remove the substrate, and finally transfer the LED chip from the temporary substrate to the display on the backplane to prepare a display device. [0004] However, when transferring LED chips from the temporary substrate to the display backplane, the problem of transfer failure is prone to occur. Contents of the invention [0005]...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/677H01L21/683
CPCH01L21/67H01L21/677H01L21/683
Inventor 姚志博夏继业李之升曹轩
Owner CHENGDU VISTAR OPTEOLECTRONICS CO LTD
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