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Semiconductor packaging equipment

A technology for packaging equipment and semiconductors, which is used in semiconductor/solid-state device manufacturing, electrical components, circuits, etc. It can solve the problems of lack of semiconductor mounting positioning height, single method of adjusting wafer clamps, and high equipment cost, and achieve convenient positioning height, improve Safety and improved functionality

Pending Publication Date: 2020-12-01
成芯半导体(江苏)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides a semiconductor packaging device, which is equipped with a convenient and smooth adjustment of the height of the placement plate, which is convenient for adjusting the clamping height of the wafer, and performs clamping adjustment according to different wafer sizes, and has auxiliary processing The effect of production solves the problems of traditional single function, single adjustment method of wafer fixture, lack of adjustment of semiconductor installation and positioning height, and high equipment cost

Method used

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  • Semiconductor packaging equipment
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Embodiment Construction

[0026] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.

[0027] Such as Figure 1-4 As shown, a semiconductor packaging device includes a base 1, the top outer surface of the base 1 is provided with a placement plate 2, the bottom of the placement plate 2 and the inside of the base 1 are provided with a substrate 3, and the two sides of the bottom of the substrate 3 are located on the base 1 is provided with an adjustment rod 4, the outer side of the adjustment rod 4 and between the two sides inside the base 1 is provided with a rotating rod 5, the right side of the rotating rod 5 and the right side of the base 1 is provided with a motor 6, the motor 6 Y160M1-2 type asynchronous motor can be used, the power is 11kW, the outer surface of the base 1 is provided with a support plate 7, the top outer surfac...

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Abstract

The invention discloses semiconductor packaging equipment, which comprises a base. A placing plate is arranged on the outer surface of the top of the base; a base plate is arranged at the bottom of the placing plate and located in the base; adjusting rods are arranged on the two sides of the bottom of the base plate and located in the base. A rotating rod is arranged on the outer side of the adjusting rod and located between the two sides of the interior of the base. A motor is arranged on the right side of the rotating rod and located on the right side of the base, a supporting plate is arranged on the outer surface of the outer side of the base, a top cover is arranged on the outer surface of the top of the supporting plate, a positioning frame is arranged at the bottom of the top coverand located on the outer surface of the outer side of the supporting plate, and multiple sets of clamping rods are arranged in the positioning frame. The semiconductor packaging equipment has the functions of adjusting the placing height and adjusting clamping, and is low in production cost, easy and convenient to operate and convenient to overhaul and maintain, and the semiconductor packaging cost is greatly reduced.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a semiconductor packaging device. Background technique [0002] The semiconductor production process consists of wafer fabrication, wafer testing, chip packaging, and post-package testing. After plastic sealing, a series of operations are carried out, such as post-curing, cutting and forming, electroplating and printing. The typical packaging process is: scribing, chip loading, bonding, plastic packaging, deflashing, electroplating, printing, rib cutting and molding, appearance inspection, finished product testing, packaging and shipping. Existing semiconductor packaging equipment needs to clamp the wafer during processing, and multiple motors drive the clamps to fix them. This processing method has high mechanical costs. At the same time, it lacks the function of adjusting the positioning height. single, greatly increasing the cost of semiconductor packaging. ...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/687
CPCH01L21/67121H01L21/68721Y02P70/50
Inventor 邓佳佳
Owner 成芯半导体(江苏)有限公司
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