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High-voltage electrostatic protection structure

A high-voltage electrostatic and protective structure technology, applied in the direction of circuits, electrical components, electrical solid devices, etc., can solve problems such as inability to turn them off, and achieve the effect of improving antistatic ability

Pending Publication Date: 2020-12-01
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

One-way thyristor is a controllable rectifier electronic component, which can be turned from off to on under the action of an external control signal, but once it is turned on, the external signal cannot turn it off, only by removing the load or reducing the voltage. The voltage at both ends makes it turn off), which can greatly improve the ESD capability, but the maintenance voltage Vh of the pure SCR structure after Snap-back generally does not exceed 10V, and there is a greater risk of latch-up in the application of high-voltage ports

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0052] like image 3 As shown, the structure is located on an N-type buried layer NBL in a P-type substrate.

[0053] In section, the high-voltage electrostatic protection has a left-right symmetrical structure, including a P-type high-voltage well 1 located in the central region, and N-type high-voltage wells 2 and 3 located on both sides of the high-voltage well 1.

[0054] In the high-voltage well 1, the central region has an N-type heavily doped region 1, and the two sides of the heavily doped region 1 are symmetrically arranged in sequence with the first field oxygen, the P-type heavily doped region 2, and the second field. oxygen.

[0055] In the high-voltage well two, there is a source region of an LDMOS device, and an N-type heavily doped region three leading out the high-voltage well two, and a third field oxygen is separated between the source region and the heavily doped region three ;

[0056] The substrate surface between the high-voltage well 2 and the high-vo...

Embodiment 2

[0065] The second embodiment provides another high-voltage electrostatic protection structure, which increases the number of heavily doped regions in the high-voltage well at the drain end on the basis of the first embodiment. like Figure 5 As shown, the main difference lies in the structure of the high-voltage well 4, that is, the arrangement of the heavily doped region in the high-voltage well at the drain end, Figure 5 Middle-drain end high-voltage P well High-voltage well four The heavily doped region four located in the central region is P-type, and the fourth field oxygen, the heavily doped region five (N+), and the fifth field are symmetrically arranged in sequence on both sides around it. Oxygen, heavily doped region six (P+) and sixth field oxygen.

[0066] In cross-section, the high-voltage electrostatic protection has a left-right symmetrical structure, including a high-voltage well 4 of the first conductivity type located in the central area, and high-voltage we...

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Abstract

The invention discloses a high-voltage electrostatic protection structure, which is located on a buried layer, is of a bilateral symmetry structure on the section, and comprises a first high-voltage trap having first conductive type and located in a center region, a second high-voltage trap and a third high-voltage trap, wherein the second high-voltage trap and the third high-voltage trap are located on the two sides of the first high-voltage trap and have second conductive types, in the first high-voltage trap, a heavily doped region I having second conductive type is arranged in the centralregion of the first high-voltage trap, a first field oxide, a heavily doped region II having first conductive type and a second field oxide are symmetrically arranged on two sides of the heavily dopedregion I in sequence, and in the second high-voltage trap, a source region and a heavily doped region III having a LDMOS device are arranged, and a third field oxide is arranged between the source region and the heavily doped region III at an interval. According to the invention, the polygonal or circular injection regions with adjustable quantity and diffusion radius are added in the high-voltage well region where the primary drain region is located, so that the current distribution of the parasitic SCR structure is flexibly controlled, the proportion of a current outflow path is adjusted, and the antistatic capability of the device is improved.

Description

technical field [0001] The invention relates to the field of design and manufacture of semiconductor devices, in particular to a high-voltage electrostatic protection structure. Background technique [0002] Static electricity is an objective natural phenomenon, which can be produced in many ways, such as contact, friction, induction between electrical appliances, etc. Static electricity is characterized by long-term accumulation, high voltage, low power, small current and short action time. Static electricity causes serious harm in many fields. Friction electrification and human body static electricity are two major hazards in the electronics industry, which often cause unstable operation or even damage of electronic and electrical products. [0003] As the feature size of the semiconductor integrated circuit manufacturing process becomes smaller and smaller, the size of the chip unit is also smaller and smaller, and the antistatic ability of the chip becomes more and mor...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/02H01L29/78
CPCH01L27/0262H01L29/7817
Inventor 苏庆
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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