Method for manufacturing wiring board with protective film
A manufacturing method and wiring board technology, which are applied in the fields of printed circuit manufacturing, non-metallic protective layer coating, and secondary treatment of printed circuits, etc., which can solve the problems of complicated manufacturing process of printed circuit boards, insufficient reduction of voids, and decompression, etc. , to achieve the effect of simple process, prevention of voids, and excellent productivity
Pending Publication Date: 2020-12-01
TAMURA KK
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Problems solved by technology
[0006] However, in the method for producing a printed wiring board in Patent Document 1, when the curable insulating material is applied, there is a problem that a decompression process is required, and the production process of the printed wiring board is complicated.
In addition, in the method of applying the curable insulating material under reduced pressure in Patent Document 1, the reduction of voids generated in the protective film between conductors may not be sufficient, and the heat resistance of the protective film may be improved. room for
Method used
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Effect test
Embodiment 1～3、 comparative example 1
[0109] The components shown in the following Table 1 were blended in the proportions shown in the following Table 1, and mixed and dispersed at room temperature with 3 rollers to prepare the first photosensitive resin used in Examples 1 to 3 and Comparative Example 1. Composition, the second photosensitive resin composition and thermosetting resin composition. Regarding the viscosity measurement of the first photosensitive resin composition, the second photosensitive resin composition, and the thermosetting resin composition, when the viscosity was measured using an Iwata cup (in the following Table 1, the unit of viscosity is "s"), NK-2 (ANEST IWATA Corporation) was used to measure the rotational viscosity (in the following Table 1, the unit of viscosity is "dPa·s"), using a Brookfield B-type viscometer (sample temperature 25°C, rotational speed 50rpm, Bo Lefey Company). Then, the prepared 1st photosensitive resin composition, the 2nd photosensitive resin composition, and th...
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Abstract
The invention provides a method for manufacturing a wiring board with a protective film. The method includes: a first cured film forming step of forming a first cured film having a film thickness greater than a thickness of a conductor after photocuring by applying a first photosensitive resin composition to a wiring board having a substrate and a conductor provided on the substrate and then performing photocuring processing, wherein a second cured film having a film thickness greater than a thickness of the conductor after photocuring is formed; a film thickness reduction step for reducing the film thickness of a first cured film by cutting the surface portion of the first cured film; a second cured film forming step for forming a second cured film by applying a second photosensitive resin composition to the surface of the first cured film having a reduced film thickness and then photocuring the same, wherein the total of the film thickness of the first cured film after the film thickness reduction step and the film thickness of the second cured film after the photocuring is greater than the thickness of the conductor.
Description
technical field [0001] The present invention relates to a method of manufacturing a wiring board such as a printed wiring board having a protective film such as an insulating coating. Background technique [0002] A wiring board such as a printed wiring board is used to form a pattern of a conductive circuit on a substrate, and to mount electronic components on pads of the pattern by soldering. In addition, the conductive circuit portion other than the pad is covered with a solder resist film as a protective film. This prevents solder from adhering to unnecessary portions of the conductor circuit when soldering electronic components on a printed wiring board, and prevents conductors from being directly exposed to air to corrode due to oxidation and humidity. [0003] In recent years, with the increase in output of electronic equipment such as solar cells used for photovoltaic power generation and high-power motors mounted on vehicles to reduce environmental burdens, high vo...
Claims
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Login to View More IPC IPC(8): H05K3/28
CPCH05K3/282
Inventor 伊藤贤斋藤彰一津留紘树
Owner TAMURA KK