Solder mask manufacturing process method for high-power thick copper circuit board

Abstract

The invention provides a solder mask manufacturing process method for a high-power thick copper circuit board. The method is completed through two times of screen drying, board grinding, exposure, development and high-temperature baking. In the first time of screen drying, an 18T printing screen board with 18 meshes per square centimeter is adopted to replace a traditional 36T or 43T screen board,so that bad conditions such as bubbles and pseudo copper leakage are reduced. Original normal exposure production is changed into the following procedures: manufacturing a first exposure pattern film; making the first exposure pattern film attached to the surface of a PCB; using an exposure machine for carrying out light curing so as to make ink at positions between circuits cured. the overall thickness of the surface of the board is consistent through the ink exposure mode, and the solder mask function between the circuits is improved.

Description

technical field [0001] The invention relates to the technical field of PCB manufacturing, in particular to a welding-proof manufacturing process for a high-power thick copper circuit board. Background technique [0002] The full name of PCB is "Printed Circuit Board", which means printed circuit board. It is an important electronic component and a support for electronic components. It is mainly made by electronic printing; There are certain disadvantages in the process of soldering production and assembly; first, printed circuit board ink is a viscous liquid, because of its unstable flow direction and uneven thermal conductivity, it is very easy to get stuck on the edge of the hole when it is solidified. Protrusions that are not positioned will affect the overall appearance of the circuit board; secondly, the circuit board is equipped with more and more complex electronic system components, and some components have precise performance. The ink protrusions can easily cause fa...

AI Technical Summary

Problems solved by technology

[0002]The full name of PCB is "Printed Circuit Board", which means printed circuit board. It is an important electronic component and a support for electronic components. It is made by printing; the existing printed circuit boards have certain disadvantages in the production process of solder mask and when they are assembled and used; Due to the uneven thermal conductivity, it is very easy to produce uneven protrusions on the edge of the hole during curing, which affects the overall appearance of the circuit board; secondly, the circuit board is equipped with more and more complex electronic system parts, and some parts have precise performance. The protrusions can easily cause irreversible problems such as false welding, falling off, and burnout during welding, and even cause the customer to scrap the whole machine; finally, the ink protrusions cause the performance of the entire printed circuit board to decline, and in severe cases cause user safety accidents. It also destroys users' confidence in the brand and seriously affects the competitiveness of the market and products.

[0003] In the production process of existing PCB circuit boards, in the steps of solder mask production, when producing thick copper circuit boards of 4-10OZ or above, after two printing exposures using the traditional method, the edges of individual lines will appear Bubbles and false copper leakage and other bad conditions, and the problem of uneven ink layer on the circuit, so there is an urgent need for a new circuit board solder mask manufacturing method, which can make the overall thickness of the board uniform, and reduce air bubbles and false leakage. Copper and other bad conditions, improve the insulation function between lines, etc.

Images