A method for multi-wire cutting crystal ingot through guide frame

Abstract

The invention relates to a method for multi-wire cutting of crystal ingots through a guide frame, which belongs to the technical field of crystal material cutting; it solves the problem that the edge of the crystal ingot is easily damaged in the process of multi-wire cutting of the existing crystal ingot, and the phenomenon of broken wires and lobes occurs; the specific steps are as follows: : First, glue a layer of guide strips to the outer ring of the cylindrical surface of the crystal ingot; use a square ceramic guide frame to glue the crystal into the central groove of the guide frame; then glue the guide frame to the cutting base; clamp the cutting base After finishing, start multi-wire cutting; the present invention can effectively reduce the damage to the edge of the crystal ingot due to wire vibration during the cutting process by bonding the crystal ingot to the guide frame and cutting with the guide frame; reduce the risk of wire breakage; reduce the risk of splinters; The cutting process is similar to a one-step process, which reduces the difficulty of writing the cutting process.

Description

technical field [0001] The invention belongs to the technical field of crystal material cutting, and in particular relates to a method for multi-wire cutting crystal ingots through a guide frame. Background technique [0002] Silicon wafers for semiconductors and crystalline solar cells are basically made of single crystals and polycrystals cast from silicon. In order to process the drawn ingots or cast polycrystalline ingots into the shape of silicon wafers , the main processing method is to wind a cutting wire around a guide wheel with equally spaced cutting grooves on it to control the direction of the cutting wire, and then let the cutting wire move at high speed in both directions while pressing the crystal ingot on the wire. Multi-wire dicing produces very thin wafers, so that a large number of wafers can be obtained in one cut. [0003] For the traditional sapphire cutting process, the rod-shaped or ingot-shaped sapphire crystal is cut into slices using the technolog...

AI Technical Summary

Problems solved by technology

As the shaking angle changes, the height of the cutting line at the cutting part of the ingot often changes, and the edge of the ingot is often damaged due to the vibration of the line during the cutting process; there are problems of broken lines and splits

Images