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A Large Format Camera System with Field of View Stitching

A field of view splicing and surface camera technology, which is applied to the parts of TV systems, parts of color TVs, TVs, etc., can solve the problems of high cost of the whole machine, long device development cycle, and many devices, so as to facilitate image processing and positioning, reducing the number of splicing devices, and the effect of large side field of view

Active Publication Date: 2022-03-04
BEIJING RES INST OF SPATIAL MECHANICAL & ELECTRICAL TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The disadvantage of using a single ultra-large-format imaging device to realize the imaging system is that the general ultra-large-format imaging device needs to be customized separately, the device development technology is difficult, the device development cycle is long, and the cost is high
The splicing of the inner field of view produces a halo at the splicing point, which poses certain problems for calibration and processing; the splicing of the outer field of view to achieve large-format imaging generally requires at least four lenses, and the camera system is complex
The amount of data in the camera system, due to the use of many devices, the cost of the whole machine is relatively high

Method used

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  • A Large Format Camera System with Field of View Stitching
  • A Large Format Camera System with Field of View Stitching
  • A Large Format Camera System with Field of View Stitching

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Embodiment Construction

[0032] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided for more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art. It should be noted that, in the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and examples.

[0033] figure 2 It is a block diagram of a camera system provided by an embodiment of the present invention; image 3 It is a schematic structural diagram ...

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Abstract

The invention discloses a large-format camera system with field-of-view splicing, comprising: a first focal plane component, a second focal plane component, a first large-format camera lens, a second large-format camera lens, and a low-resolution camera focal plane component , low resolution camera lens, camera electronics unit, scan control unit, payload mounting plate, azimuth frame, azimuth drive mechanism, azimuth axis, pitch frame, pitch drive mechanism and pitch axis. The present invention realizes large-format imaging by combining the external field of view splicing method and the two-dimensional scanning mechanism.

Description

technical field [0001] The invention belongs to the technical field of photoelectric imaging, and in particular relates to a large-format camera system with field of view splicing. Background technique [0002] The large-format camera system is an important technical means of remote sensing information acquisition, and has a wide range of applications in various fields such as reconnaissance, surveying and mapping, military affairs, and commerce. The large-format camera system for ground remote sensing can be used for satellite platform orbital observation, flat flow airship fixed-point observation or aviation aircraft platform cruise observation. There are mainly three imaging methods for obtaining large-format imaging systems: [0003] The first is to implement an imaging system using a single-chip ultra-large-format imaging device. For example, the DMC III camera system launched by Leica in 2016 uses an individually customized ultra-large format CMOS sensor with a pixel...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04N5/225H04N5/232
CPCH04N23/54H04N23/50H04N23/55H04N23/951H04N23/667H04N23/69H04N23/695
Inventor 刘秀洪扬张翠宋立国
Owner BEIJING RES INST OF SPATIAL MECHANICAL & ELECTRICAL TECH
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