Method for automatically adjusting technological parameters in monocrystalline silicon rod cutting

Abstract

The invention discloses a method for automatically adjusting technological parameters in monocrystalline silicon rod cutting, and belongs to the technical field of crystalline silicon cutting. The method comprises the following steps of detecting of a wire bow, wherein real-time data of each period and position is monitored in real time, and the depth of the real-time wire bow is calculated according to detection data; modeling; and adjustment of the table speed according to a model. The yield of crystalline silicon can be effectively increased, manual intervention is reduced, the cutting quality of the crystalline silicon is improved, the cost is saved for enterprises, and the market prospect is wide.

Description

technical field [0001] The invention belongs to the technical field of crystal silicon cutting, and in particular relates to a method for automatically adjusting process parameters for single crystal silicon rod cutting. Background technique [0002] When the silicon rod cutting starts, the silicon block to be cut is placed on the diamond wire net in the middle of the two cutting rollers by the silicon block control device (processing table) set directly above the cutting rollers, starting from the starting coordinates set by the process At the beginning, silicon rods are vertically fed downward at a certain speed (table speed) for cutting. During the cutting process, the wire bow of the cutting line will change, which will affect the quality of crystal silicon cutting. In the past, manual inspection was used to intervene in the adjustment of the wire bow. The efficiency of manual adjustment is low, and if the intervention is not timely, it will easily affect the quality of ...

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Problems solved by technology

[0002] When the silicon rod cutting starts, the silicon block to be cut is placed on the diamond wire net in the middle of the two cutting rollers by the silicon block control device (processing table) set directly above the cutting rollers, starting from the starting coordinates set by the process At the beginning, silicon rods are vertically fed downward at a certain speed (table speed) for cutting. During the cutting process, the wire bow of the cutting line will change, which will affect the quality of crystal silicon cutting. In the past, manual inspection was used to intervene in the adjustment of the wire bow. The efficiency of artificial adjustment is low, and if the intervention is not timely, it will easily affect the quality of crystal silicon cutting. Therefore, it is of great significance to be able to invent a method for automatically adjusting process parameters

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