Formula, preparation method and application of high-temperature-resistant hot melt adhesive

A warm and melting technology, used in adhesives, polymer adhesive additives, non-polymer adhesive additives, etc.

Inactive Publication Date: 2020-12-15
SHANGHAI CHANGYUAN ELECTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, in the heat shrinkable tube industry, it is difficult for the inner rubber layer material to meet the above requirements at the same time.

Method used

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  • Formula, preparation method and application of high-temperature-resistant hot melt adhesive
  • Formula, preparation method and application of high-temperature-resistant hot melt adhesive
  • Formula, preparation method and application of high-temperature-resistant hot melt adhesive

Examples

Experimental program
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Effect test

preparation example Construction

[0030] According to another embodiment provided by the present invention, it is a method for preparing a high temperature resistant hot melt adhesive, comprising the following preparation steps:

[0031] Take 30-60 parts of radiation crosslinking type base material, 10-50 parts of radiation-degradable base material, 8-20 parts of tackifier, and 1-3 parts of antioxidant in parts by weight. Blending and extruding with a screw extruder, the extrusion temperature is 80-170°C, and then cooled and pelletized by an underwater pelletizer or a pull rod or a water tank to obtain a high temperature resistant hot melt adhesive.

[0032] The high-temperature-resistant hot-melt adhesive prepared according to the preparation method is used as the inner rubber layer material of the double-wall heat-shrinkable sleeve, which can not only make the double-wall heat-shrinkable sleeve have certain fluidity when heated, but also play a role in rapid shrinkage and insulation. The function of sealing pr...

Embodiment 1

[0035] The formula component of this embodiment is shown in Table 1-1:

[0036] Table 1-1

[0037]

[0038] The test results of various performance indicators of the high temperature resistant hot melt adhesive prepared according to the above formula are shown in the following table 1-2:

[0039] Table 1-2

[0040]

[0041] The high-temperature-resistant hot-melt adhesive prepared in this example is used as the material of the inner rubber layer. It can be seen from Table 1-2 that the viscosity change before and after irradiation treatment is very small, that is, the fluidity of the inner rubber layer does not change after heating. There is no obvious change, and at the same time, the softening point changes very little before and after irradiation treatment, that is, the softening point changes little after heating, so that the prepared double-wall heat shrinkable sleeve can meet the pre-designed working environment. It can meet the high temperature resistance require...

Embodiment 2

[0053] The formula component of this embodiment is shown in Table 2-1:

[0054] table 2-1

[0055]

[0056] The test results of various performance indicators of the high-temperature-resistant hot-melt adhesive prepared according to the above formula are shown in Table 2-2 below:

[0057] Table 2-2

[0058]

[0059] The high-temperature-resistant hot-melt adhesive prepared in this example is used as the material of the inner rubber layer. It can be seen from Table 2-2 that the viscosity change before and after irradiation treatment is very small, that is, the fluidity of the inner rubber layer does not change after heating. There is no obvious change, and at the same time, the softening point changes very little before and after irradiation treatment, that is, the softening point changes little after heating, so that the prepared double-wall heat shrinkable sleeve can meet the pre-designed working environment. It can meet the high temperature resistance requirements, a...

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Abstract

The invention discloses a formula of a high-temperature-resistant hot melt adhesive. The high-temperature-resistant hot melt adhesive comprises the following components in parts by mass: 30 to 60 parts of a radiation crosslinking base material, 10 to 50 parts of a radiation-degradable base material, 8 to 20 parts of a tackifier and 1 to 3 parts of an antioxidant. Correspondingly, the invention discloses a preparation method of the high-temperature-resistant hot melt adhesive, which comprises the following steps: taking the radiation crosslinking base material, the radiation-degradable base material, the tackifier and the antioxidant in parts by weight, mixing, blending, extruding at the extrusion temperature of 80 to 170 DEG C, cooling, and granulating to obtain the high-temperature-resistant hot melt adhesive. The prepared high-temperature-resistant hot melt adhesive is applied to an inner adhesive layer material of a double-wall heat-shrinkable sleeve, so that the double-wall heat-shrinkable sleeve can achieve the effects of rapid shrinkage and insulation sealing protection when being heated, and the effect that the inner adhesive layer material does not flow obviously in a high-temperature environment can be achieved.

Description

technical field [0001] The invention belongs to the technical field of heat-shrinkable sleeves, and relates to a formula, a preparation method and an application of a heat-shrinkable sleeve. Background technique [0002] The double-wall heat shrinkable sleeve is an outer layer composed of radiation cross-linked polyolefin material, and the inner layer is a specially designed hot melt adhesive material. During use, the double-wall heat-shrinkable sleeve is heated, and the adhesive layer melts and adheres to the substrate to be protected when heated, and plays the role of insulation and sealing protection after cooling and shaping. It is mainly used in aviation, aerospace, automobile, home appliance, communication, petrochemical and other fields, and plays an insulating and sealing role for wiring harness, cable connection and branch. [0003] With the continuous development of the economy, the demand for double-wall heat-shrinkable sleeves is increasing, which puts forward h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J123/12C09J177/00C09J123/20C09J123/08C09J123/06C09J123/16C09J175/04C09J11/08C09J11/06
CPCC08L2201/08C08L2203/18C08L2205/02C08L2205/03C08L2205/035C09J11/06C09J11/08C09J123/0853C09J123/12C09J123/14C09J177/00C08L77/00C08L23/22C08K5/526C08L23/06C08L23/14C08L23/12C08L33/08C08L53/02C08K5/1345C08K5/13C08L23/0853C08L23/0869C08K5/24C08L53/025
Inventor 饶小波应泽人乔孟雅龙鹏王志
Owner SHANGHAI CHANGYUAN ELECTRONICS MATERIAL
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