Exhaust device and process chamber
A technology of exhaust device and exhaust pipeline, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problem that the vertical oxidation/annealing furnace cannot meet the requirements of high-temperature process technology, and the damage of seals and connectors and other problems to achieve the effect of improving exhaust stability, reducing damage, and improving sealing stability
Pending Publication Date: 2020-12-18
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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[0004] However, in the prior art, when the reaction chamber 12 is performing a high-temperature process, such as a process above 1000° C., the temperature of the gas passing through the exhaust pipe interface 141 will be very high, which leads to the The seals and connections between the gas cooling device 15 will be damaged due to the inability to withstand high temperatures, so this vertical oxidation / annealing furnace cannot meet the needs of high-temperature process technology
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[0036] In order for those skilled in the art to better understand the technical solution of the present invention, the exhaust device and the process chamber provided by the present invention will be described in detail below with reference to the accompanying drawings.
[0037] Such as Figure 2-Figure 6 As shown, this embodiment provides an exhaust device, the exhaust device includes a connecting pipeline 21 and a cooling assembly, wherein the connecting pipeline 21 is respectively connected with the exhaust pipeline 23 of the process chamber and the tail gas treatment device for The tail gas discharged from the exhaust pipe 23 is transported to the tail gas treatment device; the cooling assembly is arranged on the connecting pipe 21 for cooling the connecting pipe 21 and the tail gas flowing through the connecting pipe 21 .
[0038]The exhaust device provided in this embodiment cools the connecting pipeline 21 and the exhaust gas flowing through the connecting pipeline 21 b...
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The invention provides an exhaust device and a process chamber. The exhaust device comprises a connecting pipeline and a cooling assembly. The connecting pipeline is connected with an exhaust pipelineof the process chamber and a tail gas treatment device, and is used for transmitting a tail gas exhausted from the exhaust pipeline to the tail gas treatment device; and the cooling assembly is arranged on the connecting pipeline and used for cooling the connecting pipeline and the tail gas flowing through the connecting pipeline. According to the exhaust device and the process chamber provided by the invention, sealing stability between the exhaust pipeline and the tail gas treatment device can be improved so that the exhaust stability of the exhaust device is increased.
Description
technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to an exhaust device and a process chamber. Background technique [0002] At present, the vertical oxidation / annealing furnace is one of the important process equipment in the pre-process of the integrated circuit production line, which includes a reaction chamber, a process gas supply system, an exhaust pipe and a tail gas treatment system. With the development of process technology, the process temperature required for some processes is getting higher and higher, which leads to higher and higher temperature of the exhaust gas discharged from the exhaust pipe to the exhaust gas treatment system. In order to improve the heat resistance of the exhaust gas treatment system for long-term work nature, the tail gas needs to be cooled and then discharged to the tail gas treatment system, and due to the needs of the vertical oxidation / annealing furnace process, the reaction chamb...
Claims
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IPC IPC(8): H01L21/67
CPCH01L21/67017H01L21/67098
Inventor 董金卫
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD