Method for rapidly growing InSb single crystal

A single crystal, fast technology, applied in the direction of single crystal growth, crystal growth, single crystal growth, etc., can solve the problems of lower crystal quality, difficulty in escaping the latent heat of crystallization, low production efficiency of single crystal, etc., and achieve the effect of improving growth efficiency

Inactive Publication Date: 2020-12-25
CHINA ELECTRONICS TECH GRP NO 46 RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, for the material InSb, its own thermal conductivity is low, only 17W / mK, and it is difficult to escape the latent heat of crystallization during the growth process. It is very easy to form local stress inside the crystal and generate dislocations, thereby reducing the quality of the crystal. So, this is the second reason for the small angled shoulders and slow growth
In order to obtain a large-sized crystal ingot, a longer shouldering time is required, and the production efficiency of single crystal growth is lower; secondly, due to the longer shouldering time, during the slow shouldering process, due to temperature fluctuations, environmental vibrations, Factors such as impurities in the oxide layer can lead to the production probability of twin crystals, polycrystals, twin crystals, etc., that is, the rate of single crystal crystal formation is reduced to a certain extent

Method used

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  • Method for rapidly growing InSb single crystal
  • Method for rapidly growing InSb single crystal
  • Method for rapidly growing InSb single crystal

Examples

Experimental program
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Effect test

Embodiment 1

[0019] Embodiment 1: If you want to obtain a 2-inch InSb single crystal, you should follow the figure 2 The crystal structure shown is for crystal growth. After the bottom surface of the seed crystal is in contact with the melt, it is slowly immersed in about 5mm, and the heating power is set to 31.2%. After the edge of the bottom surface of the crystal is slightly melted, it reaches a state of complete fusion with the melt. At 4 o'clock, start the seed crystal pulling device. In order to ensure the continuity of crystal growth, the initial pulling speed is set to 10mm / h, and the heating power at that time is reduced by 0.2%, that is, the heating power is 31.0%. When the size of the new crystal reaches about 50mm again, keep the heating power unchanged , and increase the seed crystal pulling speed to 15mm / h, wait for the fusion state 4 of the bottom surface of the ingot and the melt to complete the seeding process, and enter the stage of uniform and fast single crystal growth...

Embodiment 2

[0020] Embodiment two: if you want to obtain 3 inches or 4 inches of InSb single crystal, you should follow image 3 For crystal growth with the crystal structure shown, slowly immerse the bottom of the seed crystal into the melt for about 5mm, set the heating power to 31.2%, and after the edge of the bottom of the crystal melts slightly, it reaches a state of complete fusion with the melt. , start the seed crystal pulling device. In order to ensure the continuity of crystal growth, the initial pulling speed is set to 10mm / h, and the heating power at that time is reduced by 0.4%, that is, the heating power is 30.8%. When the size of the new crystal reaches about 3 inches or 4 inches, keep The heating power remains unchanged, and the seed crystal pulling speed is increased to 12mm / h, and the same-diameter and fast single crystal growth stage is also entered. The subsequent process is implemented according to the traditional InSb crystal growth process, and a 3-inch or 4-inch In...

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Abstract

The invention discloses a method for rapidly growing an InSb single crystal. The method comprises the steps: selecting an InSb single crystal ingot as a seeding ingot, wherein the diameter of a wide neck part at the bottom of the ingot is not less than 50mm; cutting, grinding and polishing the bottom: fixing the upper end of the seed crystal square column on a seed crystal rod, and connecting theseed crystal square column to a pulling device; immersing the wide neck part at the bottom of the crystal into the melt, slowly immersing and setting heating power after the bottom surface is in contact with the melt, starting the pulling device when the bottom surface of the crystal and the melt are completely fused, the initial pulling speed is 8-10mm/h and the heating power is reduced by 0.1-0.4%, keeping the heating power unchanged, and increasing the pulling speed to 12-15mm/h when the new crystal reaches the target size; and finishing the seeding process when the bottom surface of the crystal ingot and the melt are in a fused state. According to the method, twin crystals or polycrystals are prevented from appearing in the shouldering process of the seed crystals, large-size InSb single crystals are obtained in a short time, and the growth efficiency and the crystallization rate of the InSb single crystals are improved.

Description

technical field [0001] The present invention relates to single crystal preparation, in particular to a method for rapid growth of InSb single crystal, and in particular to selection of seeded crystal ingot, treatment of seeded crystal ingot and seeding process in rapid preparation of InSb single crystal. Background technique [0002] In the process of growing InSb (indium antimonide) crystal by the Czochralski method, the InSb raw material is firstly heated and melted in a crucible. The InSb seed crystal fixed on the seed rod is slowly immersed into the melt from the surface of the melt, the bottom of the dipped seed crystal is fused with the melt, the seed rod is slowly pulled upwards, and the heat is dissipated through the seed rod. The melt in contact with the seed crystal first obtains a certain degree of supercooling, and crystallization occurs. The seed crystal rod is continuously pulled to make the crystallization process continue, thereby realizing continuous InSb c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C30B29/40C30B15/00C30B15/36
CPCC30B15/00C30B15/36C30B29/40
Inventor 于凯徐世海王健洪颖霍晓青刘莎莎张嵩李强程红娟
Owner CHINA ELECTRONICS TECH GRP NO 46 RES INST
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